Cypress CY7C1576V18, CY7C1565V18, CY7C1563V18 Maximum Ratings, DC Electrical Characteristics

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CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18

Maximum Ratings

Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested.

Storage Temperature ................................. –65°C to +150°C

Ambient Temperature with Power Applied.. –55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.5V to +2.9V

Supply Voltage on VDDQ Relative to GND

–0.5V to +VDD

DC Applied to Outputs in High-Z

–0.5V to VDDQ + 0.3V

DC Input Voltage [14]

–0.5V to V + 0.3V

 

 

DD

Current into Outputs (LOW)

 

20 mA

Static Discharge Voltage (MIL-STD-883, M. 3015)...

>2001V

Latch-up Current

....................................................

 

>200 mA

Operating Range

 

 

 

 

 

 

 

 

 

Ambient

VDD [18]

VDDQ [18]

Range

 

Temperature (TA)

Commercial

 

0°C to +70°C

1.8 ± 0.1V

1.4V to

 

 

 

 

VDD

Industrial

 

–40°C to +85°C

 

Electrical Characteristics

DC Electrical Characteristics

Over the Operating Range [15]

Parameter

Description

Test Conditions

 

Min

Typ

Max

Unit

VDD

Power Supply Voltage

 

 

 

1.7

1.8

1.9

V

VDDQ

IO Supply Voltage

 

 

 

1.4

1.5

VDD

V

VOH

Output HIGH Voltage

Note 19

 

 

VDDQ/2 – 0.12

 

VDDQ/2 + 0.12

V

VOL

Output LOW Voltage

Note 20

 

 

VDDQ/2 – 0.12

 

VDDQ/2 + 0.12

V

VOH(LOW)

Output HIGH Voltage

IOH = −0.1 mA, Nominal Impedance

 

VDDQ – 0.2

 

VDDQ

V

VOL(LOW)

Output LOW Voltage

IOL = 0.1mA, Nominal Impedance

 

VSS

 

0.2

V

VIH

Input HIGH Voltage [14]

 

 

 

VREF + 0.1

 

VDDQ + 0.15

V

VIL

Input LOW Voltage [14]

 

 

 

–0.15

 

VREF – 0.1

V

IX

Input Leakage Current

GND ≤ VI ≤ VDDQ

 

 

−2

 

2

μA

IOZ

Output Leakage Current

GND ≤ VI ≤ VDDQ, Output Disabled

 

−2

 

2

μA

VREF

Input Reference Voltage [21]

Typical Value = 0.75V

 

 

0.68

0.75

0.95

V

IDD [22]

VDD Operating Supply

VDD = Max,

400 MHz

x8

 

 

1400

mA

 

 

IOUT = 0 mA,

 

 

 

 

 

 

 

 

 

x9

 

 

1400

 

 

 

f = fMAX = 1/tCYC

 

 

 

 

 

 

 

 

 

x18

 

 

1400

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

x36

 

 

1400

 

 

 

 

 

 

 

 

 

 

 

 

 

375 MHz

x8

 

 

1300

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

x9

 

 

1300

 

 

 

 

 

 

 

 

 

 

 

 

 

 

x18

 

 

1300

 

 

 

 

 

 

 

 

 

 

 

 

 

 

x36

 

 

1300

 

 

 

 

 

 

 

 

 

 

Notes

18.Power up: Assumes a linear ramp from 0V to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

19.Output are impedance controlled. IOH = (VDDQ/2)/(RQ/5) for values of 175 ohms <= RQ <= 350 ohms.

20.Output are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175 ohms <= RQ <= 350 ohms.

21.VREF (min) = 0.68V or 0.46VDDQ, whichever is larger, VREF (max) = 0.95V or 0.54VDDQ, whichever is smaller.

22.The operation current is calculated with 50% read cycle and 50% write cycle.

Document Number: 001-05384 Rev. *F

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Contents Features Configurations Selection GuideFunctional Description Description 400 MHz 375 MHz 333 MHz 300 MHz UnitDoff Logic Block Diagram CY7C1561V18Logic Block Diagram CY7C1576V18 Logic Block Diagram CY7C1563V18 Logic Block Diagram CY7C1565V18Pin Configuration Ball Fbga 15 x 17 x 1.4 mm PinoutCY7C1561V18 8M x CY7C1576V18 8M xCY7C1565V18 2M x CY7C1563V18 4M xWPS BWS Negative Input Clock Input Pin DefinitionsPin Name Pin Description Power Supply Inputs to the Core of the Device Power Supply Inputs for the Outputs of the DeviceTDO for Jtag TCK Pin for JtagFunctional Overview Read OperationsWrite Operations Byte Write OperationsValid Data Indicator Qvld Application ExampleDepth Expansion Programmable ImpedanceTruth Table Write Cycle DescriptionsOperation CommentsWrite cycle description table for CY7C1576V18 follows Write cycle description table for CY7C1565V18 followsDevice Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram State diagram for the TAP controller followsTAP Controller Block Diagram TAP Electrical CharacteristicsTAP AC Switching Characteristics TAP Timing and Test ConditionsIdentification Register Definitions Scan Register SizesInstruction Codes Register Name Bit SizeBoundary Scan Order Bit # Bump IDDLL Constraints Power Up Sequence in QDR-II+ SramPower Up Sequence Maximum Ratings Electrical CharacteristicsDC Electrical Characteristics Automatic Power down Max VDD 400 MHz VDD Operating Supply VDD = Max 333 MHz300 MHz Current Both Ports DeselectedAC Electrical Characteristics CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitSwitching Characteristics Consortium Description 400 MHz 375 MHz 333 MHz 300 MHz UnitParameter Min Max HighSwitching Waveforms Read/Write/Deselect Sequence 31, 32Ordering Information 333 Package Diagram Ball Fbga 15 x 17 x 1.4 mmDocument History