Cypress CY7C1386DV25 Maximum Ratings, Operating Range, Electrical Characteristics, Range Ambient

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CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25

Maximum Ratings

Exceeding the maximum ratings may impair the useful life of the device. For user guidelines, not tested.

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.5V to +3.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to +VDD

DC Voltage Applied to Outputs

–0.5V to VDDQ + 0.5V

in Tri-State

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

20 mA

Static Discharge Voltage

>2001V

(per MIL-STD-883, Method 3015)

 

Latch-up Current

>200 mA

Operating Range

Range

Ambient

VDD

VDDQ

Temperature

Commercial

0°C to +70°C

2.5V ±5%

2.5V –5%

 

 

 

to VDD

Industrial

–40°C to +85°C

 

Electrical Characteristics

Over the Operating Range [17, 18]

Parameter

Description

Test Conditions

Min.

Max.

Unit

VDD

Power Supply Voltage

 

 

2.375

2.625

V

VDDQ

IO Supply Voltage

for 2.5V IO

 

2.375

VDD

V

VOH

Output HIGH Voltage

for 2.5V IO, IOH = –1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

for 2.5V IO, IOL = 1.0 mA

 

 

0.4

V

V

IH

Input HIGH Voltage [17]

for 2.5V IO

 

1.7

V + 0.3V

V

 

 

 

 

 

DD

 

VIL

Input LOW Voltage [17]

for 2.5V IO

 

–0.3

0.7

V

IX

Input Leakage Current

GND ≤ VI ≤ VDDQ

 

–5

5

µA

 

 

except ZZ and MODE

 

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

µA

 

 

 

Input = VDD

 

 

5

µA

 

 

Input Current of ZZ

Input = VSS

 

–5

 

µA

 

 

 

Input = VDD

 

 

30

µA

IOZ

Output Leakage Current

GND ≤ VI ≤ VDDQ, Output Disabled

–5

5

µA

IDD

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

4.0-ns cycle, 250 MHz

 

350

mA

 

 

Current

f = fMAX = 1/tCYC

 

 

 

 

 

 

5-ns cycle, 200 MHz

 

300

mA

 

 

 

 

6-ns cycle, 167 MHz

 

275

mA

 

 

 

 

 

 

 

ISB1

Automatic CE

VDD = Max, Device Deselected,

4.0-ns cycle, 250 MHz

 

160

mA

 

 

Power Down

VIN ≥ VIH or VIN ≤ VIL

 

 

 

 

 

 

5-ns cycle, 200 MHz

 

150

mA

 

 

Current—TTL Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

 

6-ns cycle, 167 MHz

 

140

mA

 

 

 

 

 

 

 

 

 

 

 

 

ISB2

Automatic CE

VDD = Max, Device Deselected,

All speeds

 

70

mA

 

 

Power Down

VIN ≤ 0.3V or VIN > VDDQ – 0.3V,

 

 

 

 

 

 

Current—CMOS Inputs

f = 0

 

 

 

 

ISB3

Automatic CE

VDD = Max, Device Deselected,

4.0-ns cycle, 250 MHz

 

135

mA

 

 

Power Down

or VIN ≤ 0.3V or VIN > VDDQ – 0.3V

 

 

 

 

 

 

5-ns cycle, 200 MHz

 

130

mA

 

 

Current—CMOS Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

 

6-ns cycle, 167 MHz

 

125

mA

 

 

 

 

 

 

 

 

 

 

 

 

ISB4

Automatic CE

VDD = Max, Device Deselected,

All Speeds

 

80

mA

 

 

Power Down

VIN ≥ VIH or VIN ≤ VIL, f = 0

 

 

 

 

 

 

Current—TTL Inputs

 

 

 

 

 

Notes

17.Overshoot: VIH(AC) < VDD +1.5V (pulse width less than tCYC/2), undershoot: VIL(AC) > –2V (pulse width less than tCYC/2).

18.Tpower up: assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

Document Number: 38-05548 Rev. *E

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Contents 250 MHz 200 MHz 167 MHz Unit FeaturesSelection Guide Cypress Semiconductor CorporationLogic Block Diagram CY7C1386DV25/CY7C1386FV25 3 512K x Logic Block Diagram CY7C1387DV25/CY7C1387FV25 3 1M xPin Configurations CY7C1386DV25 512K XCY7C1387DV25 1M x Pin Configurations Ball BGA 1 Chip Enable Pin Configurations Ball Fbga Pinout 3 Chip Enable Name Description Power supply inputs to the core of the devicePin Definitions Byte write select inputs, active LOW. Qualified withFunctional Overview Interleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Parameter Description Test Conditions Min Max UnitOperation Add. Used Function CY7C1386DV25/CY7C1386FV25 Partial Truth Table for Read/Write 5Truth Table for Read/Write 5 Function CY7C1387DV25/CY7C1387FV25TAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag Instruction Register TAP Instruction SetTAP Timing BypassTAP AC Output Load Equivalent TAP AC Switching CharacteristicsTAP AC Test Conditions Parameter Description Min Max Unit ClockIdentification Codes Identification Register DefinitionsScan Register Sizes Register Name Bit SizeBall BGA Boundary Scan Order 14 Bit # Ball IDA11 Operating Range Electrical CharacteristicsMaximum Ratings Range AmbientAC Test Loads and Waveforms CapacitanceThermal Resistance PackageParameter Description 250 MHz 200 MHz 167 MHz Unit Min Max Switching CharacteristicsSetup Times Output TimesSwitching Waveforms Read Cycle TimingWrite Cycle Timing 26 AdscRead/Write Cycle Timing 26, 28 ZZ Mode Timing 30 DON’T CareOrdering Information CY7C1387DV25-250BZXI Document Number 38-05548 Rev. *E Package Diagrams Pin Plastic Quad Flat pack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Date Orig. Description of Change Document History