Cypress CY7C1386FV25 manual Capacitance, Thermal Resistance, AC Test Loads and Waveforms, Package

CY7C1386DV25, CY7C1386FV25

CY7C1387DV25, CY7C1387FV25

Capacitance [19]

Parameter	Description	Test Conditions	100 TQFP	119 BGA	165 FBGA	Unit
			Package	Package	Package
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,	5	8	9	pF
		VDD/VDDQ = 2.5V
CCLK	Clock Input Capacitance		5	8	9	pF
CIO	Input/Output Capacitance		5	8	9	pF

Thermal Resistance [19]

Parameter	Description	Test Conditions	100 TQFP	119 BGA	165 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard	28.66	23.8	20.7	°C/W
	(Junction to Ambient)	test methods and procedures
		for measuring thermal
ΘJC	Thermal Resistance		4.08	6.2	4.0	°C/W
		impedance, per EIA/JESD51.
	(Junction to Case)

AC Test Loads and Waveforms

2.5V IO Test Load

OUTPUT

2.5V

R = 1667Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL = 50Ω

10%

90%

5 pF

R = 1538Ω

GND

≤ 1 ns

VT = 1.25V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

90%

10%

≤ 1 ns

Note

19. Tested initially and after any design or process change that may affect these parameters.

Document Number: 38-05548 Rev. *E Page 19 of 30

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