CY7C1386DV25, CY7C1386FV25
CY7C1387DV25, CY7C1387FV25
Package Diagrams (continued)
Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
TOP VIEW
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| TOP VIEW |
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PIN 1 CORNER |
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| PIN 1 CORNER |
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1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
BOTTOM VIEW
BOTTOM VIEWPIN 1 CORNER
PIN 1 CORNER
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| Ø0.05 M C |
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| Ø0.05 M C |
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| Ø0.25 M C A B |
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| Ø0.50 | .25 M C A B | ||||
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| (165X) |
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| +0.14 |
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11 | 10 | 9 | 8 | 7 | 6 | 5 | Ø0.50 | (165X) | ||
4 | 3 | 2 | 1 | |||||||
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| +0.14 |
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15.00±0.10
15.00±0.10
A | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
B | A |
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CB
DC
ED
FE
GF
H | G | 15.00±0.10 |
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J | H |
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K | J |
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LK
ML
NM
PN
RP R
14.00 15.00±0.10
1.00
7.0014.00
1.00
7.00
11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1A |
BA
CB
DC
ED
FE
GF
HG
JH
KJ
LK
ML
NM
PN
RP
R
A
0.25 C
A
0.3600.25.3±0C .05
A
B | 13.00±0.10 |
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B | 13.00±0.10 |
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0.53±0.05 | 1.40 MAX. | 0.15 C 1.40 MAX. | 0.15 C |
C | SEATING PLANE |
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SEATING PLANE |
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0.36 | C |
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0.35±0.06 | 0.35±0.06 |
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| 1.00 |
A | 5.00 |
1.00 | |
| 5.00 |
| 10.00 |
| 10.00 |
B | 13.00±0.10 |
B | 13.00±0.10 |
0.15(4X) |
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0.15(4X) |
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NOTES : |
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SOLDERNOTESPAD TYPE: : NON-SOLDER MASK DEFINED (NSMD)
PACKAGESOLDERW IGHTPAD: 0TYPE.475g:
JEDEC REFERENCEPACKAGE WEIGHT:
PACKAGEJEDECODEREFERENCE: BB0AC :
PACKAGE CODE : BB0AC
i486 is a trademark, and Intel and Pentium are registered trademarks of Intel Corporation. PowerPC is a trademark of IBM Corporation. All product and company names mentioned in this document are the trademarks of their respective holders.
Document Number: | Page 29 of 30 |
© Cypress Semiconductor Corporation,
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