Cypress CY7C1387FV25, CY7C1387DV25 manual Features, Selection Guide, MHz 200 MHz 167 MHz Unit

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CY7C1386DV25, CY7C1386FV25

CY7C1387DV25, CY7C1387FV25

18-Mbit (512K x 36/1M x 18) Pipelined DCD Sync SRAM

Features

Functional Description [1]

Supports bus operation up to 250 MHz

Available speed grades are 250, 200, and 167 MHz

Registered inputs and outputs for pipelined operation

Optimal for performance (Double-Cycle deselect)

Depth expansion without wait state

2.5V + 5% power supply (VDD)

Fast clock-to-output times, 2.6 ns (for 250 MHz device)

Provides high-performance 3-1-1-1 access rate

User selectable burst counter supporting Intel® Pentium® interleaved or linear burst sequences

Separate processor and controller address strobes

Synchronous self timed writes

Asynchronous output enable

CY7C1386DV25/CY7C1387DV25 available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball FBGA package. CY7C1386FV25/CY7C1387FV25 available in Pb-free and non Pb-free 119-ball BGA package

IEEE 1149.1 JTAG-Compatible Boundary Scan

ZZ sleep mode option

Selection Guide

The CY7C1386DV25/CY7C1387DV25/CY7C1386FV25/ CY7C1387FV25 SRAM integrates 512K x 36 and 1M x 18 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive edge triggered clock input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining chip enable (CE1), depth expansion chip enables (CE2 and CE3 [2]), burst control inputs (ADSC, ADSP, and ADV), write enables (BWX, and BWE), and global write (GW). Asynchronous inputs include the output enable (OE) and the ZZ pin.

Addresses and chip enables are registered at rising edge of clock when either address strobe processor (ADSP) or address strobe controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the advance pin (ADV).

Address, data inputs, and write controls are registered on-chip to initiate a self timed write cycle.This part supports byte write operations (see Pin Definitions on page 6 and Truth Table [4, 5, 6, 7, 8, 9] on page 9 for further details). Write cycles can be one to four bytes wide as controlled by the byte write control inputs. GW active LOW causes all bytes to be written. This device incorporates an additional pipelined enable register which delays turning off the output buffers an additional cycle when a deselect is executed.This feature allows depth expansion without penalizing system performance.

The CY7C1386DV25/CY7C1387DV25/CY7C1386FV25/ CY7C1387FV25 operates from a +2.5V power supply. All inputs and outputs are JEDEC-standard and JESD8-5-compatible.

 

250 MHz

200 MHz

167 MHz

Unit

Maximum Access Time

2.6

3.0

3.4

ns

 

 

 

 

 

Maximum Operating Current

350

300

275

mA

 

 

 

 

 

Maximum CMOS Standby Current

70

70

70

mA

 

 

 

 

 

Notes

1.For best practices or recommendations, please refer to the Cypress application note AN1064, SRAM System Design Guidelines on www.cypress.com.

2.CE3, CE2 are for TQFP and 165 FBGA packages only. 119 BGA is offered only in 1 chip enable.

Cypress Semiconductor Corporation

198 Champion Court • San Jose, CA 95134-1709

408-943-2600

Document Number: 38-05548 Rev. *E

 

Revised Feburary 15, 2007

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Contents Selection Guide Features250 MHz 200 MHz 167 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1387DV25/CY7C1387FV25 3 1M x Logic Block Diagram CY7C1386DV25/CY7C1386FV25 3 512K xCY7C1386DV25 512K X Pin ConfigurationsCY7C1387DV25 1M x Pin Configurations Ball BGA 1 Chip Enable Pin Configurations Ball Fbga Pinout 3 Chip Enable Pin Definitions Power supply inputs to the core of the deviceName Description Byte write select inputs, active LOW. Qualified withFunctional Overview Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDParameter Description Test Conditions Min Max Unit ZZ Mode Electrical CharacteristicsOperation Add. Used Truth Table for Read/Write 5 Partial Truth Table for Read/Write 5Function CY7C1386DV25/CY7C1386FV25 Function CY7C1387DV25/CY7C1387FV25TAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Instruction RegisterBypass TAP TimingTAP AC Test Conditions TAP AC Switching CharacteristicsTAP AC Output Load Equivalent Parameter Description Min Max Unit ClockScan Register Sizes Identification Register DefinitionsIdentification Codes Register Name Bit SizeBit # Ball ID Ball BGA Boundary Scan Order 14A11 Maximum Ratings Electrical CharacteristicsOperating Range Range AmbientThermal Resistance CapacitanceAC Test Loads and Waveforms PackageSetup Times Switching CharacteristicsParameter Description 250 MHz 200 MHz 167 MHz Unit Min Max Output TimesRead Cycle Timing Switching WaveformsAdsc Write Cycle Timing 26Read/Write Cycle Timing 26, 28 DON’T Care ZZ Mode Timing 30Ordering Information CY7C1387DV25-250BZXI Document Number 38-05548 Rev. *E Pin Plastic Quad Flat pack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change