HP 8000 tower manual Processor Changing/Upgrading, Supported Processors partial listing

Processor/Memory Subsystem

3.2.2 Processor Changing/Upgrading

All models use the LGA775 ZIF (Socket T) mounting socket. These systems require that the processor use an integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan assembly as the original to ensure proper cooling. The heatsink and attachment clip are specially designed provide maximum heat transfer from the processor component.

CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such a condition could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions.

Table 3-1 provides a sample listing of processors supported by these systems.

Table 3-1

Supported Processors (partial listing)

			Highest	Highest
			Clock	FSB		Form
Intel	Core		Speed	Speed	L2	Factor
Series	design	Features	in GHz	in MHz	Cache	support
Q9nnn	quad	VT, [1]	3.00	1333	2 x 6 MB	SFF, CMT
Q6nnn	quad	VT, [1]	2.66	1066	2 x 4 MB	SFF, CMT
E8nnn	dual	vPro, VT, TXT, [1]	3.33	1333	6 MB
E6nnn	dual	vPro, VT, TXT, [1]	3.00	1333	4 MB	all
E4nnn	dual	[1]	2.60	800	2 MB	all

NOTE:

[1]Standard Intel feature set including EM64T, XD, and EIST support. Refer to www.intel.com for detailed information.

CAUTION: The USDT form factor can support a processor with a maximum power consumption of 65 watts. The SFF and CMT form factors can support a processor with a maximum power consumption of 95 watts. Exceeding these limits can result in system damage and lost data.

Technical Reference Guide www.hp.com 3-3