HP 8000 tower manual Specifications, HP ProtectTools Embedded Security

Page 26
2.3.11 HP ProtectTools Embedded Security

System Overview

2.3.11 HP ProtectTools Embedded Security

HP ProtectTools Embedded Security is a hardware/software solution providing file and folder encrypytion service that integrates with the operating system. The software component—the HP ProtectTools Embedded Security Manager (preinstalled), controls the basic operation of the hardware component—the Trusted Platform Module (TPM) security chip. These components are compliant with the Trusted Computing Group (TCG) security standards organization.

HP ProtectTools Embedded Security includes the following features:

Enhanced Windows operating system files and folder encryption

Enhanced email encryption—built-in authentication for Outlook, Outlook Express, Lotus Notes, Eudora

Strengthends defense against hacking, system attacks, denial of service and network attacks

“Embedded smart card” functionality

Strengthens authentication with LANs, WANs.

Works with/enhances third-party security solutions

HP ProtectTools Embedded Security Manager is acecssed through a Windows Control Panel applet. The management functions are accessible thro;ugh establishlished protocols such as DMI, SNMP, or WEBEM.

2.4 Specifications

This section includes the environmental, electrical, and physical specifications for the systems covered in this guide. Where provided, metric statistics are given in parenthesis. Specifications are subject to change without notice.

Table 2-6

Environmental Specifications (Factory Configuration)

Parameter

Operating

Non-operating

 

 

Ambient Air Temperature 50o to 95o F (10o to 35o C, max.

-22oto 140o F (-30oto 60o C, max.

 

rate of change < 10°C/Hr)

rate of change < 20°C/Hr)

 

 

 

 

Shock (w/o damage)

 

5 Gs [1]

20 Gs [1]

 

 

 

 

Vibration

0.000215

G2/Hz, 10-300 Hz

0.0005 G2/Hz, 10-500 Hz

 

 

 

 

Humidity

10-90%

Rh @ 28o C max.

5-95% Rh @ 38.7o C max.

 

wet bulb temperature

wet bulb temperature

 

 

 

Maximum Altitude

10,000 ft (3048 m) [2]

30,000 ft (9144 m) [2]

NOTE:

[1]Peak input acceleration during an 11 ms half-sine shock pulse.

[2]Maximum rate of change: 1500 ft/min.

 

2-10

www.hp.com

Technical Reference Guide

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Contents Document Part Number Technical Reference GuideHP Compaq 8000 Elite Series Business Desktop Computers DecemberFirst Edition December Document Part Number Technical Reference GuideHP Compaq 8000 Elite Series Business Desktop Computers 2 System Overview Contents1 Introduction 5 Input/Output Interfaces 3 Processor/Memory Subsystem4 System Support 7 Power and Signal Distribution 6 Integrated Graphics Subsystem8 SYSTEM BIOS A Error Messages and Codes Index1.2 Additional Information Sources Introduction1.1 About this Guide 1.1.1 Online Viewing1.4.1 Special Notices 1.3 Serial Number1.4 Notational Conventions 1.4.2 ValuesAcronym or 1.5 Common Acronyms and AbbreviationsAcronyms and Abbreviations AbbreviationTable 1-1 Continued Acronym or Table 1-1 ContinuedAcronyms and Abbreviations AbbreviationAcronym or Table 1-1 ContinuedAcronyms and Abbreviations AbbreviationAcronym or Table 1-1 ContinuedAcronyms and Abbreviations AbbreviationAcronym or Table 1-1 ContinuedAcronyms and Abbreviations AbbreviationAcronym or 1-10 System Overview 2.1 Introduction2.2 Features Feature Differences by Form Factor USDT2.3 System Architecture Architectural Differences by Form FactorSystem Overview Chipset Components and Functionality 2.3.1 Intel Processor Support2.3.2 Chipset Support Component Functions 2.3.3 Support Components2.3.4 System Memory 2.3.7 Universal Serial Bus Interface 2.3.5 Mass Storage2.3.6 Serial Interface 2.3.8 Network Interface ControllerIntegrated Graphics Subsystem Statistics 2.3.9 Graphics Subsystem2.3.10 Audio Subsystem Environmental Specifications Factory Configuration 2.4 Specifications2.3.11 HP ProtectTools Embedded Security Power Supply Electrical Specifications Physical Specifications2-12 Processor/Memory Subsystem 3.1 Introduction3.2 Intel Processors 3.2.1 Intel Processor Overview3.2.2 Processor Changing/Upgrading Supported Processors partial listing3.3 Memory Subsystem Memory Socket Loading 3.3.1 Memory Upgrading3.3.2 Memory Mapping and Pre-allocation Base Memory Figure 3-2. System Memory Map for maximum of 8 gigabytesExpansion Area 4.2 PCI Bus Overview System Support4.1 Introduction 4.2.1 PCI 2.3 Bus OperationSystem Support PCI Component Configuration AccessWired to PCI BusTransaction Protocol Layer 4.2.2 PCI Express Bus OperationSoftware/Driver Layer PCI Bus Mastering Devices4.2.4 PCI Interrupts 4.2.5 PCI Power Management Support4.2.3 Option ROM Mapping Link LayerPCI 2.3 Bus Connector Pinout 4.2.6 PCI ConnectorsPCI 2.3 Connector Figure 4-2. 32-bit, 5.0-volt PCI 2.3 Bus ConnectorFigure 4-3. PCIe Bus Connectors PCIe ConnectorsPCIe Bus Connector Pinout 8259 Mode 4.3 System Resources4.3.1 Interrupts APIC Mode4.3.2 Direct Memory Access PCI Interrupt Distribution4.4 Real-Time Clock and Configuration Memory 4.4.1 Clearing CMOS4.5.1 Security Functions 4.5 System Management4.4.2 Standard CMOS Locations Configuration Memory CMOS MapCable Lock Provision Power-On / Setup PasswordSetup Password I/O Interface SecurityACPI Wake-Up Events 4.5.2 Power ManagementSmart Cover Lock Optional System Operational Status LED Indications 4.5.3 System Status4.5.4 Thermal Sensing and Cooling 4.6 Register Map and Miscellaneous Functions 4.6.1 System I/O MapFunction System I/O MapI/O Port SIO Controller Functions 4.6.2 GPIO FunctionsICH10 Functions Input/Output Interfaces 5.1 Introduction5.2 SATA/eSATA Interfaces 5.2.1 SATA interface5.2.2 eSATA interface 5.3 Serial Interface DB-9 Serial Connector Pinout5.4.2 Enhanced Parallel Port Mode 5.4 Parallel Interface Support5.4.1 Standard Parallel Port Mode 5.4.3 Extended Capabilities Port Modee w q - 9 8 7 6 5 4 3 2 1 g f d s a p o i u y t r 5.4.4 Parallel Interface ConnectorDB-25 Parallel Connector Pinout 5.5 Keyboard/Pointing Device Interface 5.5.1 Keyboard Interface OperationKeyboard/Pointing Device Connector Pinout 5.5.3 Keyboard/Pointing Device Interface Connector5.5.2 Pointing Device Interface Operation 5.6.1 USB Connector 5.6 Universal Serial Bus InterfaceUSB Cable Length Data 5.6.2 USB Cable DataUSB Connector Pinout USB Color Code5.7 Audio Subsystem Figure 5-8. Audio Subsystem Functional Block Diagram5.7.3 Audio Multistreaming 5.7.1 HD Audio Controller5.7.2 HD Audio Link Bus HD Audio Subsystem Specifications 5.7.4 Audio SpecificationsThe specifications for the HD Audio subsystem are listed in Table 5.8 Network Interface Controller 5.8.2 Alert Standard Format Support 5.8.3 Power Management Support5.8.1 Wake-On-LAN Support Table 5-11. NIC Specifications 5.8.4 NIC Connector5.8.5 NIC Specifications Integrated Graphics Subsystem 6.1 Introduction6.2 Functional Description Maximum Memory Allocation SDRAM InstalledGMA 4500 Memory Allocation 6.3 Display Modes 6.4 Upgrading 6.5 Monitor Connectors 6.5.1 Analog Monitor Connector6.5.2 DisplayPort Connector Figure 6-3. DisplayPort Connector, as viewed from rear of chassisIntegrated Graphics Subsystem 7.1 Introduction Power and Signal Distribution7.2 USDT Power Distribution USDT 135-Watt Power Supply Unit Specifications 7.3 SFF/CMT Power DistributionTable 7-1 lists the specifications of the external supply Figure 7-2. SFF/CMT Power Distribution and Cabling, Block DiagramSFF 240-Watt Power Supply Unit Specifications CMT 320-Watt Power Supply Unit Specifications7.4 Power Control 7.4.1 Power ButtonPower failure power supply is overloaded. Check storage Power LED IndicationsPower LED Pre-video memory error. Incompatible or incorrectly seatedPower Management Event 7.5 Power Management7.4.2 Wake Up Events Wake-On-LANPower System Power StatesPower StateDesignator 7.6 Signal DistributionSystem Board Connector, Indicator, and Switch Designations Component functionFigure 7-3. System Board Header Pinouts Figure 7-5 shows pinouts of headers used on the sytem boardsTable 7-7. Continued 7-10 System BIOS 8.1 Introduction8.2.2 Changeable Splash Screen 8.2 ROM Flashing8.2.1 Upgrading 8.3.2 Network Boot F12 Support 8.3 Boot Functions8.3.1 Boot Device Order 8.3.3 Memory Detection and Configuration8.3.4 Boot Error Codes 8.4 Client Management Functions System ID Numbers 8.4.1 System ID and ROM Type8.4.2 Temperature Status 8.5 SMBIOS SMBIOS Functions8.6 USB Legacy Support 8.7 Management Engine FunctionsA.1 Introduction Error Messages and CodesA.2 Beep/Power LED Codes A.3 Power-On Self Test POST Messages Error Messages and Codes1794--Inaccessible device attached to SATA Power-On Self Test POST MessagesError Message 1796-SATA Cabling Error1801-Microcode Patch Error A.4 System Error Messages Error Messages and CodesTable A-4 A.5 Memory Error MessagesMemory Error Messages Table A-4. Continued A.6 Keyboard Error MessagesMemory Error Messages MessageInt. test, LpBk. test., and data register failed A.7 Printer Error MessagesA.8 Video Graphics Error Messages Int. test, LpBk. test., and cntrl. register failedA.9 Diskette Drive Error Messages A.10 Serial Interface Error Messages Table A-9 Serial Interface Error MessagesA.11 Modem Communications Error Messages Table A-10 Modem Communications Error MessagesA.12 System Status Error Messages A.13 Hard Drive Error Messages Cntlr. failed to deallocate bad sectorsxx = 00, Hard drive ID test xx = 01, Hard drive format test A.14 Hard Drive Error Messages EGA Mono. graphics mode test failed A.15 Video Graphics Error MessagesA.16 Audio Error Messages Lightpen graphics test failed, no respA.17 DVD/CD-ROM Error Messages A.18 Network Interface Error MessagesProbable Cause A.19 SCSI Interface Error Messages 65xx-xx, 66xx-xxMessage A.20 Pointing Device Interface Error Messages 8601-xx A-20 Index Numerics
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