HP 8000 tower manual System Status, Thermal Sensing and Cooling

Page 47
4.5.3 System Status

System Support

4.5.3 System Status

These systems provide a visual indication of system boot, ROM flash, and operational status through the power LED and internal speaker, as described in Table 4-8.

.

Table 4-8.

System Operational Status LED Indications

 

 

 

 

System Status

PowerLED

Beeps [2]

Action Required

S0: System on (normal

Steady green

None

None

operation)

 

 

 

 

 

 

 

S1: Suspend

Blinks green @ .5 Hz

None

None

S3: Suspend to RAM

Blinks green @ .5 Hz

None

None

S4: Suspend to disk

Off – clear

None

None

S5: Soft off

Off – clear

None

None

Processor thermal shutdown

Blinks red 2 times @ 1 Hz [1]

2

Check air flow, fans, heatsink

Processor not seated / installed

Blinks red 3 times @ 1 Hz [1]

3

Check processor

 

 

 

presence/seating

 

 

 

 

Power supply overload failure

Blinks red 4 times @ 1 Hz [1]

4

Check system board problem

 

 

 

[3],

 

 

 

 

Memory error (pre-video)

Blinks red 5 times @ 1 Hz [1]

5

Check DIMMs, system board

Video error

Blinks red 6 times @ 1 Hz [1]

6

Check graphics card or

 

 

 

system board

 

 

 

 

PCA failure detected by BIOS

Blinks red 7 times @ 1 Hz [1]

7

Replace system board

(pre-video)

 

 

 

 

 

 

 

Invalid ROM checksum error

Blinks red 8 times @ 1 Hz [1]

8

Reflash BIOS ROM

Boot failure (after power on)

Blinks red 9 times @ 1 Hz [1]

9

Check power supply,

 

 

 

processor, sys. bd

 

 

 

 

Bad option card

Blinks red 10 times @ 1 Hz [1]

None

Replace option card

NOTES:

Beeps are repeated for 5 cycles, after which only blinking LED indication continues.

[1]Repeated after 2 second pause.

[2]Beeps are produced by the internal chassis speaker.

[3]Check that CPU power connector P3 is plugged in.

4.5.4Thermal Sensing and Cooling

All systems feature a variable-speed fan mounted as part of the processor heatsink assembly. All systems also provide or support an auxiliary chassis fan. All fans are controlled through temperature sensing logic on the system board and/or in the power supply. There are some electrical differences between form factors and between some models, although the overall functionally is the same. Typical cooling conditions include the following:

1.Normal—Low fan speed.

2.Hot processor—ASIC directs Speed Control logic to increase speed of fan(s).

3.Hot power supply—Power supply increases speed of fan(s).

4.Sleep state—Fan(s) turned off. Hot processor or power supply will result in starting fan(s).

 

Technical Reference Guide

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Contents December Technical Reference GuideHP Compaq 8000 Elite Series Business Desktop Computers Document Part NumberFirst Edition December Document Part Number Technical Reference GuideHP Compaq 8000 Elite Series Business Desktop Computers 2 System Overview Contents1 Introduction 5 Input/Output Interfaces 3 Processor/Memory Subsystem4 System Support 6 Integrated Graphics Subsystem 7 Power and Signal DistributionA Error Messages and Codes Index 8 SYSTEM BIOS1.1.1 Online Viewing Introduction1.1 About this Guide 1.2 Additional Information Sources1.4.2 Values 1.3 Serial Number1.4 Notational Conventions 1.4.1 Special NoticesAbbreviation 1.5 Common Acronyms and AbbreviationsAcronyms and Abbreviations Acronym orTable 1-1 Continued Abbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orAbbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orAbbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orAbbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orAbbreviation 1-10 2.1 Introduction System Overview2.2 Features USDT Feature Differences by Form FactorArchitectural Differences by Form Factor 2.3 System ArchitectureTechnical Reference Guide Chipset Components and Functionality 2.3.1 Intel Processor Support2.3.2 Chipset Support Component Functions 2.3.3 Support Components2.3.4 System Memory 2.3.8 Network Interface Controller 2.3.5 Mass Storage2.3.6 Serial Interface 2.3.7 Universal Serial Bus InterfaceIntegrated Graphics Subsystem Statistics 2.3.9 Graphics Subsystem2.3.10 Audio Subsystem Environmental Specifications Factory Configuration 2.4 Specifications2.3.11 HP ProtectTools Embedded Security Physical Specifications Power Supply Electrical Specifications2-12 3.1 Introduction Processor/Memory Subsystem3.2.1 Intel Processor Overview 3.2 Intel ProcessorsSupported Processors partial listing 3.2.2 Processor Changing/Upgrading3.3 Memory Subsystem Memory Socket Loading 3.3.1 Memory Upgrading3.3.2 Memory Mapping and Pre-allocation Base Memory Figure 3-2. System Memory Map for maximum of 8 gigabytesExpansion Area 4.2.1 PCI 2.3 Bus Operation System Support4.1 Introduction 4.2 PCI Bus OverviewPCI Bus PCI Component Configuration AccessWired to System SupportPCI Bus Mastering Devices 4.2.2 PCI Express Bus OperationSoftware/Driver Layer Transaction Protocol LayerLink Layer 4.2.5 PCI Power Management Support4.2.3 Option ROM Mapping 4.2.4 PCI InterruptsFigure 4-2. 32-bit, 5.0-volt PCI 2.3 Bus Connector 4.2.6 PCI ConnectorsPCI 2.3 Connector PCI 2.3 Bus Connector PinoutFigure 4-3. PCIe Bus Connectors PCIe ConnectorsPCIe Bus Connector Pinout APIC Mode 4.3 System Resources4.3.1 Interrupts 8259 ModePCI Interrupt Distribution 4.3.2 Direct Memory Access4.4.1 Clearing CMOS 4.4 Real-Time Clock and Configuration MemoryConfiguration Memory CMOS Map 4.5 System Management4.4.2 Standard CMOS Locations 4.5.1 Security FunctionsI/O Interface Security Power-On / Setup PasswordSetup Password Cable Lock ProvisionACPI Wake-Up Events 4.5.2 Power ManagementSmart Cover Lock Optional System Operational Status LED Indications 4.5.3 System Status4.5.4 Thermal Sensing and Cooling 4.6.1 System I/O Map 4.6 Register Map and Miscellaneous FunctionsFunction System I/O MapI/O Port SIO Controller Functions 4.6.2 GPIO FunctionsICH10 Functions 5.1 Introduction Input/Output Interfaces5.2.1 SATA interface 5.2 SATA/eSATA Interfaces5.2.2 eSATA interface DB-9 Serial Connector Pinout 5.3 Serial Interface5.4.3 Extended Capabilities Port Mode 5.4 Parallel Interface Support5.4.1 Standard Parallel Port Mode 5.4.2 Enhanced Parallel Port Modee w q - 9 8 7 6 5 4 3 2 1 g f d s a p o i u y t r 5.4.4 Parallel Interface ConnectorDB-25 Parallel Connector Pinout 5.5.1 Keyboard Interface Operation 5.5 Keyboard/Pointing Device InterfaceKeyboard/Pointing Device Connector Pinout 5.5.3 Keyboard/Pointing Device Interface Connector5.5.2 Pointing Device Interface Operation 5.6 Universal Serial Bus Interface 5.6.1 USB ConnectorUSB Color Code 5.6.2 USB Cable DataUSB Connector Pinout USB Cable Length DataFigure 5-8. Audio Subsystem Functional Block Diagram 5.7 Audio Subsystem5.7.3 Audio Multistreaming 5.7.1 HD Audio Controller5.7.2 HD Audio Link Bus HD Audio Subsystem Specifications 5.7.4 Audio SpecificationsThe specifications for the HD Audio subsystem are listed in Table 5.8 Network Interface Controller 5.8.2 Alert Standard Format Support 5.8.3 Power Management Support5.8.1 Wake-On-LAN Support Table 5-11. NIC Specifications 5.8.4 NIC Connector5.8.5 NIC Specifications 6.1 Introduction Integrated Graphics Subsystem6.2 Functional Description Maximum Memory Allocation SDRAM InstalledGMA 4500 Memory Allocation 6.3 Display Modes 6.4 Upgrading 6.5.1 Analog Monitor Connector 6.5 Monitor ConnectorsFigure 6-3. DisplayPort Connector, as viewed from rear of chassis 6.5.2 DisplayPort ConnectorTechnical Reference Guide 7.1 Introduction Power and Signal Distribution7.2 USDT Power Distribution Figure 7-2. SFF/CMT Power Distribution and Cabling, Block Diagram 7.3 SFF/CMT Power DistributionTable 7-1 lists the specifications of the external supply USDT 135-Watt Power Supply Unit SpecificationsCMT 320-Watt Power Supply Unit Specifications SFF 240-Watt Power Supply Unit Specifications7.4.1 Power Button 7.4 Power ControlPre-video memory error. Incompatible or incorrectly seated Power LED IndicationsPower LED Power failure power supply is overloaded. Check storageWake-On-LAN 7.5 Power Management7.4.2 Wake Up Events Power Management EventState System Power StatesPower PowerComponent function 7.6 Signal DistributionSystem Board Connector, Indicator, and Switch Designations DesignatorFigure 7-3. System Board Header Pinouts Figure 7-5 shows pinouts of headers used on the sytem boardsTable 7-7. Continued 7-10 8.1 Introduction System BIOS8.2.2 Changeable Splash Screen 8.2 ROM Flashing8.2.1 Upgrading 8.3.3 Memory Detection and Configuration 8.3 Boot Functions8.3.1 Boot Device Order 8.3.2 Network Boot F12 Support8.3.4 Boot Error Codes 8.4 Client Management Functions System ID Numbers 8.4.1 System ID and ROM Type8.4.2 Temperature Status SMBIOS Functions 8.5 SMBIOS8.7 Management Engine Functions 8.6 USB Legacy SupportA.1 Introduction Error Messages and CodesA.2 Beep/Power LED Codes Error Messages and Codes A.3 Power-On Self Test POST Messages1796-SATA Cabling Error Power-On Self Test POST MessagesError Message 1794--Inaccessible device attached to SATA1801-Microcode Patch Error Error Messages and Codes A.4 System Error MessagesTable A-4 A.5 Memory Error MessagesMemory Error Messages Message A.6 Keyboard Error MessagesMemory Error Messages Table A-4. ContinuedInt. test, LpBk. test., and cntrl. register failed A.7 Printer Error MessagesA.8 Video Graphics Error Messages Int. test, LpBk. test., and data register failedA.9 Diskette Drive Error Messages Table A-9 Serial Interface Error Messages A.10 Serial Interface Error MessagesTable A-10 Modem Communications Error Messages A.11 Modem Communications Error MessagesA.12 System Status Error Messages Cntlr. failed to deallocate bad sectors A.13 Hard Drive Error Messagesxx = 00, Hard drive ID test xx = 01, Hard drive format test A.14 Hard Drive Error Messages Lightpen graphics test failed, no resp A.15 Video Graphics Error MessagesA.16 Audio Error Messages EGA Mono. graphics mode test failedA.18 Network Interface Error Messages A.17 DVD/CD-ROM Error MessagesProbable Cause A.19 SCSI Interface Error Messages 65xx-xx, 66xx-xxMessage A.20 Pointing Device Interface Error Messages 8601-xx A-20 Numerics Index
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