HP 8000 tower manual Option ROM Mapping, PCI Interrupts, PCI Power Management Support, Link Layer

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Link Layer

System Support

Link Layer

The link layer provides data integrity by adding a sequence information prefix and a CRC suffix to the packet created by the transaction layer. Flow-control methods ensure that a packet will only be transferred if the receiving device is ready to accomodate it. A corrupted packet will be automatically re-sent.

Physical Layer

The PCIe bus uses a point-to-point, high-speed TX/RX serial lane topology. One or more full-duplex lanes transfer data serially, and the design allows for scalability depending on end-point capabilities. Each lane consists of two differential pairs of signal paths; one for transmit, one for receive (Figure 4-1).

System Board

Device A

TX

RX

PCI Express Card

Device B

Figure 4-1. PCIe Bus Lane

Each byte is transferred using 8b/10b encoding. which embeds the clock signal with the data. Operating at a 2.5 Gigabit transfer rate, a single lane can provide a data flow of 200 MBps. The bandwidth is increased if additional lanes are available for use. During the initialization process, two PCIe devices will negotiate for the number of lanes available and the speed the link can operate at. In a x1 (single lane) interface, all data bytes are transferred serially over the lane. In a multi-lane interface, data bytes are distributed across the lanes using a multiplex scheme.

4.2.3 Option ROM Mapping

During POST, the PCI bus is scanned for devices that contain their own specific firmware in ROM. Such option ROM data, if detected, is loaded into system memory's DOS compatibility area (refer to the system memory map shown in chapter 3).

4.2.4 PCI Interrupts

Eight interrupt signals (INTA- thru INTH-) are available for use by PCI devices. These signals may be generated by on-board PCI devices or by devices installed in the PCI slots. For more information on interrupts including PCI interrupt mapping refer to the “System Resources” section 4.3.

4.2.5 PCI Power Management Support

This system complies with the PCI Power Management Interface Specification (rev 1.0). The PCI Power Management Enable (PME-) signal is supported by the chipset and allows compliant PCI peripherals to initiate the power management routine.

 

4-4

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Technical Reference Guide

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Contents Document Part Number Technical Reference GuideHP Compaq 8000 Elite Series Business Desktop Computers DecemberFirst Edition December Document Part Number Technical Reference GuideHP Compaq 8000 Elite Series Business Desktop Computers 2 System Overview Contents1 Introduction 5 Input/Output Interfaces 3 Processor/Memory Subsystem4 System Support 7 Power and Signal Distribution 6 Integrated Graphics Subsystem8 SYSTEM BIOS A Error Messages and Codes Index1.2 Additional Information Sources Introduction1.1 About this Guide 1.1.1 Online Viewing1.4.1 Special Notices 1.3 Serial Number1.4 Notational Conventions 1.4.2 ValuesAcronym or 1.5 Common Acronyms and AbbreviationsAcronyms and Abbreviations AbbreviationTable 1-1 Continued Acronym or Table 1-1 ContinuedAcronyms and Abbreviations AbbreviationAcronym or Table 1-1 ContinuedAcronyms and Abbreviations AbbreviationAcronym or Table 1-1 ContinuedAcronyms and Abbreviations AbbreviationAcronym or Table 1-1 ContinuedAcronyms and Abbreviations AbbreviationAcronym or 1-10 System Overview 2.1 Introduction2.2 Features Feature Differences by Form Factor USDT2.3 System Architecture Architectural Differences by Form FactorSystem Overview Chipset Components and Functionality 2.3.1 Intel Processor Support2.3.2 Chipset Support Component Functions 2.3.3 Support Components2.3.4 System Memory 2.3.7 Universal Serial Bus Interface 2.3.5 Mass Storage2.3.6 Serial Interface 2.3.8 Network Interface ControllerIntegrated Graphics Subsystem Statistics 2.3.9 Graphics Subsystem2.3.10 Audio Subsystem Environmental Specifications Factory Configuration 2.4 Specifications2.3.11 HP ProtectTools Embedded Security Power Supply Electrical Specifications Physical Specifications2-12 Processor/Memory Subsystem 3.1 Introduction3.2 Intel Processors 3.2.1 Intel Processor Overview3.2.2 Processor Changing/Upgrading Supported Processors partial listing3.3 Memory Subsystem Memory Socket Loading 3.3.1 Memory Upgrading3.3.2 Memory Mapping and Pre-allocation Base Memory Figure 3-2. System Memory Map for maximum of 8 gigabytesExpansion Area 4.2 PCI Bus Overview System Support4.1 Introduction 4.2.1 PCI 2.3 Bus OperationSystem Support PCI Component Configuration AccessWired to PCI BusTransaction Protocol Layer 4.2.2 PCI Express Bus OperationSoftware/Driver Layer PCI Bus Mastering Devices4.2.4 PCI Interrupts 4.2.5 PCI Power Management Support4.2.3 Option ROM Mapping Link LayerPCI 2.3 Bus Connector Pinout 4.2.6 PCI ConnectorsPCI 2.3 Connector Figure 4-2. 32-bit, 5.0-volt PCI 2.3 Bus ConnectorFigure 4-3. PCIe Bus Connectors PCIe ConnectorsPCIe Bus Connector Pinout 8259 Mode 4.3 System Resources4.3.1 Interrupts APIC Mode4.3.2 Direct Memory Access PCI Interrupt Distribution4.4 Real-Time Clock and Configuration Memory 4.4.1 Clearing CMOS4.5.1 Security Functions 4.5 System Management4.4.2 Standard CMOS Locations Configuration Memory CMOS MapCable Lock Provision Power-On / Setup PasswordSetup Password I/O Interface SecurityACPI Wake-Up Events 4.5.2 Power ManagementSmart Cover Lock Optional System Operational Status LED Indications 4.5.3 System Status4.5.4 Thermal Sensing and Cooling 4.6 Register Map and Miscellaneous Functions 4.6.1 System I/O MapFunction System I/O MapI/O Port SIO Controller Functions 4.6.2 GPIO FunctionsICH10 Functions Input/Output Interfaces 5.1 Introduction5.2 SATA/eSATA Interfaces 5.2.1 SATA interface5.2.2 eSATA interface 5.3 Serial Interface DB-9 Serial Connector Pinout5.4.2 Enhanced Parallel Port Mode 5.4 Parallel Interface Support5.4.1 Standard Parallel Port Mode 5.4.3 Extended Capabilities Port Modee w q - 9 8 7 6 5 4 3 2 1 g f d s a p o i u y t r 5.4.4 Parallel Interface ConnectorDB-25 Parallel Connector Pinout 5.5 Keyboard/Pointing Device Interface 5.5.1 Keyboard Interface OperationKeyboard/Pointing Device Connector Pinout 5.5.3 Keyboard/Pointing Device Interface Connector5.5.2 Pointing Device Interface Operation 5.6.1 USB Connector 5.6 Universal Serial Bus InterfaceUSB Cable Length Data 5.6.2 USB Cable DataUSB Connector Pinout USB Color Code5.7 Audio Subsystem Figure 5-8. Audio Subsystem Functional Block Diagram5.7.3 Audio Multistreaming 5.7.1 HD Audio Controller5.7.2 HD Audio Link Bus HD Audio Subsystem Specifications 5.7.4 Audio SpecificationsThe specifications for the HD Audio subsystem are listed in Table 5.8 Network Interface Controller 5.8.2 Alert Standard Format Support 5.8.3 Power Management Support5.8.1 Wake-On-LAN Support Table 5-11. NIC Specifications 5.8.4 NIC Connector5.8.5 NIC Specifications Integrated Graphics Subsystem 6.1 Introduction6.2 Functional Description Maximum Memory Allocation SDRAM InstalledGMA 4500 Memory Allocation 6.3 Display Modes 6.4 Upgrading 6.5 Monitor Connectors 6.5.1 Analog Monitor Connector6.5.2 DisplayPort Connector Figure 6-3. DisplayPort Connector, as viewed from rear of chassisIntegrated Graphics Subsystem 7.1 Introduction Power and Signal Distribution7.2 USDT Power Distribution USDT 135-Watt Power Supply Unit Specifications 7.3 SFF/CMT Power DistributionTable 7-1 lists the specifications of the external supply Figure 7-2. SFF/CMT Power Distribution and Cabling, Block DiagramSFF 240-Watt Power Supply Unit Specifications CMT 320-Watt Power Supply Unit Specifications7.4 Power Control 7.4.1 Power ButtonPower failure power supply is overloaded. Check storage Power LED IndicationsPower LED Pre-video memory error. Incompatible or incorrectly seatedPower Management Event 7.5 Power Management7.4.2 Wake Up Events Wake-On-LANPower System Power StatesPower StateDesignator 7.6 Signal DistributionSystem Board Connector, Indicator, and Switch Designations Component functionFigure 7-3. System Board Header Pinouts Figure 7-5 shows pinouts of headers used on the sytem boardsTable 7-7. Continued 7-10 System BIOS 8.1 Introduction8.2.2 Changeable Splash Screen 8.2 ROM Flashing8.2.1 Upgrading 8.3.2 Network Boot F12 Support 8.3 Boot Functions8.3.1 Boot Device Order 8.3.3 Memory Detection and Configuration8.3.4 Boot Error Codes 8.4 Client Management Functions System ID Numbers 8.4.1 System ID and ROM Type8.4.2 Temperature Status 8.5 SMBIOS SMBIOS Functions8.6 USB Legacy Support 8.7 Management Engine FunctionsA.1 Introduction Error Messages and CodesA.2 Beep/Power LED Codes A.3 Power-On Self Test POST Messages Error Messages and Codes1794--Inaccessible device attached to SATA Power-On Self Test POST MessagesError Message 1796-SATA Cabling Error1801-Microcode Patch Error A.4 System Error Messages Error Messages and CodesTable A-4 A.5 Memory Error MessagesMemory Error Messages Table A-4. Continued A.6 Keyboard Error MessagesMemory Error Messages MessageInt. test, LpBk. test., and data register failed A.7 Printer Error MessagesA.8 Video Graphics Error Messages Int. test, LpBk. test., and cntrl. register failedA.9 Diskette Drive Error Messages A.10 Serial Interface Error Messages Table A-9 Serial Interface Error MessagesA.11 Modem Communications Error Messages Table A-10 Modem Communications Error MessagesA.12 System Status Error Messages A.13 Hard Drive Error Messages Cntlr. failed to deallocate bad sectorsxx = 00, Hard drive ID test xx = 01, Hard drive format test A.14 Hard Drive Error Messages EGA Mono. graphics mode test failed A.15 Video Graphics Error MessagesA.16 Audio Error Messages Lightpen graphics test failed, no respA.17 DVD/CD-ROM Error Messages A.18 Network Interface Error MessagesProbable Cause A.19 SCSI Interface Error Messages 65xx-xx, 66xx-xxMessage A.20 Pointing Device Interface Error Messages 8601-xx A-20 Index Numerics
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