Cypress CY7C1470V25, CY7C1474V25 Capacitance14, Thermal Resistance14, AC Test Loads and Waveforms

CY7C1470V25

CY7C1472V25

CY7C1474V25

Capacitance[14]

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max.	Max.	Max.
CADDRESS	Address Input Capacitance	TA = 25°C, f = 1 MHz,	6	6	6	pF
		VDD = 2.5V
CDATA	Data Input Capacitance		5	5	5	pF
		VDDQ = 2.5V
CCTRL	Control Input Capacitance		8	8	8	pF
CCLK	Clock Input Capacitance		6	6	6	pF
CI/O	Input/Output Capacitance		5	5	5	pF

Thermal Resistance[14]

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard	24.63	16.3	15.2	°C/W
	(Junction to Ambient)	test methods and procedures for
		measuring thermal impedance,
Θ	Thermal Resistance		2.28	2.1	1.7	°C/W
JC	(Junction to Case)	per EIA/JESD51.
AC Test Loads and Waveforms
2.5V I/O Test Load

OUTPUT

2.5V

R = 1667Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL = 50Ω

10%

90%

5 pF

GND

R = 1538Ω

≤ 1 ns

VL = 1.25V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

1.8V I/O Test Load

OUTPUT

1.8V

R = 14 KΩ

ALL INPUT PULSES

VDDQ

- 0.2

Z0

= 50Ω

OUTPUT

RL = 50Ω

0.2

10%

90%

5 pF

R = 14 KΩ

≤ 1 ns

VL =0.9V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

Note:

14. Tested initially and after any design or process changes that may affect these parameters.

90%

10%

≤ 1 ns

90%

10%

≤ 1 ns

Document #: 38-05290 Rev. *I Page 18 of 28

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