CY7C1471V25
CY7C1473V25
CY7C1475V25
Document #: 38-05287 Rev. *I Page 22 of 32
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Max.
165 FBGA
Max.
209 FBGA
Max. Unit
CADDRESS Address Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 2.5V
VDDQ = 2.5V
6 6 6 pF
CDATA Data Input Capacitance 5 5 5 pF
CCTRL Control Input Capacitance 8 8 8 pF
CCLK Clock Input Capacitance 6 6 6 pF
CIO Input-Output Capacitance 5 5 5 pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Package
165 FBGA
Package
209 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Test conditions follow
standard test methods
and procedures for
measuring thermal
impedance, according to
EIA/JESD51.
24.63 16.3 15.2 °C/W
ΘJC Thermal Resistance
(Junction to Case)
2.28 2.1 1.7 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VL= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1 ns ≤1 ns
(c)
2.5V IO Test Load
OUTPUT
R = 14 KΩ
R = 14 KΩ
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VL= 0.9V
1.8V ALL INPUT PULSES
VDDQ – 0.2
0.2
90%
10%
90%
10%
≤1 ns ≤1 ns
(c)
1.8V IO Test Load
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