CY7C1471V25

CY7C1473V25

CY7C1475V25

Document History Page

Document Title: CY7C1471V25/CY7C1473V25/CY7C1475V25, 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture

Document Number: 38-05287

REV.

ECN NO.

Issue

Orig. of

Description of Change

Date

Change

 

 

 

 

 

 

 

 

**

114674

08/06/02

PKS

New Data Sheet

 

 

 

 

 

*A

121522

01/27/03

CJM

Updated features for package offering

 

 

 

 

Updated ordering information

 

 

 

 

Changed Advanced Information to Preliminary

*B

223721

See ECN

NJY

Changed timing diagrams

 

 

 

 

Changed logic block diagrams

 

 

 

 

Modified Functional Description

 

 

 

 

Modified “Functional Overview” section

 

 

 

 

Added boundary scan order for all packages

 

 

 

 

Included thermal numbers and capacitance values for all packages

 

 

 

 

Removed 150MHz speed grade offering

 

 

 

 

Included ISB and IDD values

 

 

 

 

Changed package outline for 165FBGA package and 209-Ball BGA package

 

 

 

 

Removed 119-BGA package offering

*C

235012

See ECN

RYQ

Minor Change: The data sheets do not match on the spec system and

 

 

 

 

external web

*D

243572

See ECN

NJY

Changed ball H2 from VDD to NC in the 165-Ball FBGA package in page 6

 

 

 

 

Changed ball R11 in 209-Ball BGA package from DQPa to DQPe in page 7

 

 

 

 

Modified Capacitance values on page 21

*E

299511

See ECN

SYT

Removed 117-MHz Speed Bin

 

 

 

 

Changed ΘJA from 16.8 to 24.63 °C/W and ΘJC from 3.3 to 2.28 °C/W for 100

 

 

 

 

TQFP Package on Page # 22

 

 

 

 

Added Pb-free information for 100-Pin TQFP, 165 FBGA and 209 BGA

 

 

 

 

Packages

 

 

 

 

Added comment of ‘Pb-free BG packages availability’ below the Ordering

 

 

 

 

Information

*F

323039

See ECN

PCI

Address expansion pins/balls in the pinouts for all packages are modified as

 

 

 

 

per JEDEC standard

 

 

 

 

Added Address Expansion pins in the Pin Definitions Table

 

 

 

 

Modified VOL, VOH Test Conditions

 

 

 

 

Changed package name from 209-Ball PBGA to 209-Ball FBGA on page# 7

 

 

 

 

Added Industrial temperature range

 

 

 

 

Added Pb-free information in the ordering information table

 

 

 

 

Removed comment of ‘Pb-free BG packages availability’ below the Ordering

 

 

 

 

Information

 

 

 

 

Updated Ordering Information Table

*G

416221

See ECN

NXR

Converted from Preliminary to Final

 

 

 

 

Changed address of Cypress Semiconductor Corporation on Page# 1 from

 

 

 

 

“3901 North First Street” to “198 Champion Court”

 

 

 

 

Changed the description of IX from Input Load Current to Input Leakage

 

 

 

 

Current on page# 20

 

 

 

 

Changed the IX current values of MODE on page # 20 from –5 A and 30 A

 

 

 

 

to –30 A and 5 A

 

 

 

 

Changed the IX current values of ZZ on page # 20 from –30 A and 5 A

 

 

 

 

to –5 A and 30 A

 

 

 

 

Changed VIH < VDD to VIH < VDD on page # 20

 

 

 

 

Replaced Package Name column with Package Diagram in the Ordering

 

 

 

 

Information table

 

 

 

 

Updated Ordering Information table

Document #: 38-05287 Rev. *I

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Cypress CY7C1475V25, CY7C1473V25, CY7C1471V25 manual Document History, Issue Orig. Description of Change Date