CY8C23433, CY8C23533

Packaging Information

This section illustrates the packaging specifications for the CY8C23x33 PSoC device, along with the thermal impedances for each package, solder reflow peak temperature, and the typical package capacitance on crystal pins.

Figure 19. 32-Pin (5x5 mm) QFN

SEE NOTE 1

TOP VIEW

BOTTOM VIEW

SIDE VIEW

NOTES:

1. HATCH AREA IS SOLDERABLE EXPOSED PAD

2.BASED ON REF JEDEC # MO-248

3.PACKAGE WEIGHT: 0.0388g

4.DIMENSIONS ARE IN MILLIMETERS

001-42168 *C

Document Number: 001-44369 Rev. *B

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Cypress CY8C23533, CY8C23433 manual Packaging Information, Pin 5x5 mm QFN