Teledyne 360E instruction manual - page 9

Model 360E Instruction Manual M360E Documentation
11.2.3. Poor or Stopped Flow of Purge Gas...................................................................................................................204
11.3. Calibration Problems.................................................................................................................................................. 204
11.3.1. Miscalibrated.......................................................................................................................................................204
11.3.2. Non-Repeatable Zero and Span.........................................................................................................................205
11.3.3. Inability to Span – No SPAN Key........................................................................................................................205
11.3.4. Inability to Zero – No ZERO Key.........................................................................................................................205
11.4. Other Performance Problems.....................................................................................................................................206
11.4.1. Temperature Problems.......................................................................................................................................206
11.4.1.1. Box or Sample Temperature.......................................................................................................................206
11.4.1.2. Bench Temperature.................................................................................................................................... 206
11.4.1.3. GFC Wheel Temperature............................................................................................................................207
11.4.1.4. IR Photo-Detector TEC Temperature..........................................................................................................207
11.4.2. Excessive Noise................................................................................................................................................. 208
11.5. Subsystem Checkout..................................................................................................................................................209
11.5.1. AC Mains Configuration......................................................................................................................................209
11.5.2. DC Power Supply............................................................................................................................................... 209
11.5.3. I2C Bus................................................................................................................................................................210
11.5.4. Keyboard/Display Interface.................................................................................................................................210
11.5.5. Relay Board........................................................................................................................................................211
11.5.6. Sensor Assembly................................................................................................................................................211
11.5.6.1. Sync/Demodulator Assembly......................................................................................................................211
11.5.6.2. Opto Pickup Assembly................................................................................................................................212
11.5.6.3. GFC Wheel Drive........................................................................................................................................212
11.5.6.4. IR Source....................................................................................................................................................212
11.5.6.5. Pressure/Flow Sensor Assembly................................................................................................................212
11.5.7. Motherboard....................................................................................................................................................... 213
11.5.7.1. A/D Functions............................................................................................................................................. 213
11.5.7.2. Analog Outputs: Voltage.............................................................................................................................213
11.5.7.3. Analog Outputs: Current Loop.................................................................................................................... 214
11.5.7.4. Status Outputs............................................................................................................................................215
11.5.7.5. Control Inputs – Remote Zero, Span.......................................................................................................... 215
11.5.8. CPU....................................................................................................................................................................216
11.5.9. RS-232 Communications....................................................................................................................................216
11.5.9.1. General RS-232 Troubleshooting............................................................................................................... 216
11.5.9.2. Troubleshooting Analyzer/Modem or Terminal Operation...........................................................................217
11.6. Repair Procedures......................................................................................................................................................218
11.6.1. Repairing Sample Flow Control Assembly..........................................................................................................218
11.6.2. Removing/Replacing the GFC Wheel.................................................................................................................219
11.6.3. Disk-On-Chip Replacement Procedure...............................................................................................................220
12. A PRIMER ON ELECTRO-STATIC DISCHARGE.............................................................................................................221
12.1. How Static Charges are Created................................................................................................................................221
12.2. How Electro-Static Charges Cause Damage..............................................................................................................222
12.3. Common Myths About ESD Damage.........................................................................................................................223
12.4. Basic Principles of Static Control................................................................................................................................223
12.4.1. General Rules.....................................................................................................................................................223
12.4.2. Basic anti-ESD Procedures for Analyzer Repair and Maintenance.................................................................... 225
12.4.2.1. Working at the Instrument Rack..................................................................................................................225
12.4.2.2. Working at an Anti-ESD Work Bench..........................................................................................................225
12.4.2.3. Transferring Components from Rack to Bench and Back...........................................................................226
12.4.2.4. Opening Shipments from Teledyne Instruments Customer Service............................................................226
12.4.2.5. Packing Components for Return to Teledyne Instruments Customer Service............................................ 227
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