Tyan Computer B5382 manual Features, Enclosure

1.3Features

Enclosure

•Industry 19” rack-mountable 4U & Pedestal convertible chassis

•(3) 5.25” Driver bays

•(8) 3.5” HDD bays

•Dimensions:

-D 27.5 x W 16.8 x H 6.9 inch -D 700 x W 427 x H 176 mm

Processors

•Dual LGA771 sockets

•Support up to two Intel® Dempsey / Woodcrest / Clovertown processors

•1333/1066/667MT/s FSB

•VRD 11.0

Chipset

•Intel® “Blackford” (5000P) MCH + 6321ESB + PXH-V chipset

•Supports 667/1066/1333 MT/s FSB CPU’s

•Winbond 83627HF Super I/O chip

•Intel® PXH-V supports one PCI-X bus

Memory

•(16) 240-pin DDR2 FBDIMM sockets via two memory riser cards (M5382)

•(8) FBDIMMs on each memory riser card

•Supports maximum of 64GB of DDR2- 533/667

Expansion Slots

•(2) PCI-X 64/100MHz slots from 6321ESB

•(2) PCI-X 64/133MHz slots from PXH-V

•(1) PCI-E x16 slot (w/ x8 signals from MCH)

•(1) PCI-E x16 slot (w/ x8 signals from 6321ESB)

•(1) PCI slot

•Seven expansion slots in total

Back I/O Ports

•(1) PS/2 mouse and keyboard port

•(1) 15-pin VGA port

•(2) RJ-45 ports, side-by-side

•(4) USB 2.0 ports, side-by-side

•(1) 9-pin Serial port

•Stacked Mic-in/Line-in/Line-out audio jacks

Front Panel Features

•I/O

-(2) USB 2.0 ports

•LED indicators -Power LED -(2) LAN LEDs

-HDD LED (for internal SATA/ IDE)

•Switches

-Power and Reset switches

Integrated FireWire (1394a) Con- troller

•TI ® TSB43AB22 1394a controller

•(2) Internal IEEE 1394a pin headers

Integrated Storage Controller

•On board LSI 1068E SAS controller for model: B5382F48W8H/ B5382F48W8HR

-Support 8-port SAS for internal con- nection

Storage

•HDD support:

-Support (8) hot-swappable SAS/SATA HDD with RAID 0, 1, and 1E (Mirroring Enhanced)

•Pre-installed (1) 5.25” type 8x DVD-

ROM

Networking

•(1) Intel ® “Gilgal” (82563EB) PHY

•(2) Gigabit LAN ports

Integrated Video Controller

•ATI® ES1000

•32MB DDR memory

Motherboard

•TYAN Tempest i5000 PW (S5382)

•SSI/ Extended ATX footprint (12” x 13”)

System Cooling

•(3) 12V, 4800RPM, 120x120x38 hot- swap system fan

•(2) Active CPU heat-sink

Chapter 1: Overview 3