Intel 80960HT Heat Sink Adhesives, PowerQuad4 Plastic Package, Stepping Register Information

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80960HA/HD/HT

3.4Heat Sink Adhesives

Intel recommends silicone-based adhesives to attach heat sinks to the PGA package. There is no particular recommendation concerning the PQ4 package.

3.5PowerQuad4 Plastic Package

The 80960Hx family is available in an improved version of the common 208-lead SQFP plastic package called the PowerQuad4* (PQ4). The PQ4 package dimensions and lead pitch are identical to the SQFP package and the former PQ2 package, so the PQ4 fits into the same board footprint. The advantage of the PQ4 package is the superior thermal conductivity that allows the plastic version of the 80960Hx to operate with the same 0 ° C to 85 ° C temperature specifications as the more expensive ceramic PGA package.

The PQ4 package integrates a copper heat sink within the package to dissipate heat effectively. See Table 14 and Table 15 for more information.

3.6Stepping Register Information

The memory-mapped register at FF008710H contains the 80960Hx Device ID. The ID is identical to the ID obtained from a JTAG Query. Figure 6 defines the current 80960Hx Device IDs. The value for device identification is compliant with the IEEE 1149.1 specification and Intel standards. Table 16 describes the fields of the device ID.

Figure 6. 80960Hx Device Identification Register

 

 

 

 

 

 

 

 

 

 

 

 

 

Part Number

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Product

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Version VCC

 

 

 

Type

 

 

 

Gen

 

 

Model

 

 

 

 

Manufacturer ID

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

0

0

 

0

1

0

0

0

0

1

0

 

 

 

 

 

 

0

0

0

 

0

0

0

0

1

0

0

1

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

28

 

 

 

 

24

 

 

 

20

 

 

16

 

 

 

 

12

 

 

 

8

 

 

 

 

4

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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Datasheet

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Contents 80960HA/HD/HT 32-Bit High-Performance Superscalar Processor Datasheet Contents Contents Tables Date History80960Hx AC Characteristics on Date Revision HistoryThis page intentionally left blank Hx Product Description Product Core Voltage Operating Frequency bus/coreKey 80960Hx Features I960 Processor FamilyOn-Chip Caches and Data RAM Fail Codes For Bist bit 7 = Bit When SetRemaining Fail Codes bit 7 = Hx Instruction Set Comparison Branch Call/Return FaultInstruction Set Summary Data Movement Arithmetic Logical Bit / Bit Field / ByteHA/HD/HT Package Types and Speeds Package/Name Device Core Speed Bus Speed Order # MHzPin Descriptions Symbol DescriptionPin Description Nomenclature Hx Processor Family Pin Descriptions Sheet 1 Name Type DescriptionHx Processor Family Pin Descriptions Sheet 2 SUPHx Processor Family Pin Descriptions Sheet 3 HoldHx Processor Family Pin Descriptions Sheet 4 ClkinHx 168-Pin PGA Pinout- View from Top Pins Facing Down 80960Hx Mechanical DataHx 168-Pin PGA Pinout- View from Bottom Pins Facing Up Signal Name Hx 168-Pin PGA Pinout- Signal Name Order Sheet 1Pin Hx 168-Pin PGA Pinout- Signal Name Order Sheet 2 Hx 168-Pin PGA Pinout- Pin Number Order Sheet 1 Hx 168-Pin PGA Pinout- Pin Number Order Sheet 2 I960 Hx PQ4 Pinout- Signal Name Order Sheet 1 Hx PQ4 Pinout- Signal Name Order Sheet 2 Pin Number Order Sheet 1 Pin Number Order Sheet 2 Package Thermal Specifications Equation 1. Calculation of Ambient Temperature TAAirflow-ft/min m/sec Hx 168-Pin PGA Package Thermal CharacteristicsMaximum TA at Various Airflows in C PGA Package Only 600Thermal Resistance C/Watt Airflow ft./min m/sec Parameter Hx 208-Pin PQ4 Package Thermal CharacteristicsMaximum TA at Various Airflows in C PQ4 Package Only 400Heat Sink Adhesives PowerQuad4 Plastic PackageStepping Register Information Hx Device ID Model Types Fields of 80960Hx Device IDDevice ID Version Numbers for Different Steppings Sources for Accessories SocketsAbsolute Maximum Ratings Absolute Maximum RatingsOperating Conditions Operating ConditionsRecommended Connections VCC5 Pin Requirements VdiffVccpll Pin Requirements Sym Parameter Min Max UnitsHx D.C. Characteristics Sheet 1 D.C.SpecificationsSymbol Parameter Min Typ Max Units Hx D.C. Characteristics Sheet 2Symbol Parameter Min Max Units Input Clock 1 A.C. SpecificationsHx A.C. Characteristics Sheet 1 Synchronous Outputs 1, 2, 3Relative Output Timings 1, 2, 3, 6 Hx A.C. Characteristics Sheet 2Relative Input Timings 1, 7 C. Characteristics Notes Hx Boundary Scan Test Signal Timings1 A.C. Test Conditions A.C. Timing Waveforms Clkin WaveformOutput Float Waveform Hold Acknowledge Timings TCK Waveform Output Delay and Output Float for TBSOV1 and TBSOF1 Rise and Fall Time Derating at 85 C and Minimum VCC ICC Active Thermal vs. Frequency Output Delay vs. Temperature Bus ∼ ∼ Once Mode Reset OnceNon-Burst, Non-Pipelined Requests without Wait States Non-Burst, Non-Pipelined Read Request with Wait States Non-Burst, Non-Pipelined Write Request with Wait States BE30, Lock Blast DT/R DEN A314, SUP CT30, D/C Valid Lock Blast DT/R DEN A314, SUP Valid CT30, D/C Lock Blast DT/R DEN Wait Blast DT/R DEN Pchk Wait Blast BE30, Lock Burst, Pipelined Read Request with Wait States, 32-Bit Bus Burst, Pipelined Read Request with Wait States, 8-Bit Bus Burst, Pipelined Read Request with Wait States, 16-Bit Bus Using External Ready Terminating a Burst with Bterm Breq and Bstall Operation Clkin ADS Blast Ready Hold Functional Timing Lock Delays Holda Timing Byte Offset Word Offset 80960HA/HD/HT Summary of Aligned and Unaligned Transfers for 16-Bit Bus Summary of Aligned and Unaligned Transfers for 8-Bit Bus Idle Bus Operation Bus States Hx Boundary Scan Chain Sheet 1 80960Hx Boundary Scan ChainBoundary Scan Cell Cell Type Comment Hx Boundary Scan Chain Sheet 2 LockbarHx Boundary Scan Chain Sheet 3 NmibarHx Boundary Scan Chain Sheet 4 PchkBoundary Scan Description Language Example Adsbar Supbar E03, C02, D02, C01, E02, D01, F02, E01, F01 Bypass Input BC1 BEBAR3 XINTBAR7 80960HA/HD/HT Adsbar Adsbar Bebar Oncebar Pchkbar 100 Datasheet 101 102 Datasheet 103 104

80960HT, 80960HA, 80960HD specifications

The Intel 80960 family of microprocessors, introduced in the late 1980s, marked a significant evolution in the landscape of embedded systems and high-performance computing. The series included notable members such as the 80960HD, 80960HA, and 80960HT, each offering distinct features, technologies, and characteristics tailored for specific applications.

The Intel 80960HD was primarily designed for high-performance applications, such as real-time processing and advanced embedded control systems. With a robust architecture, the 80960HD featured a 32-bit data bus and a 32-bit address bus, enabling it to access a larger memory space and providing superior performance for computational tasks. It included a sophisticated instruction set that facilitated efficient execution, particularly for computationally intensive tasks. The internal architecture also supported pipelining, allowing multiple instructions to be processed simultaneously, thus enhancing throughput.

The 80960HA variant was tailored for high-availability applications, making it ideal for embedded systems where reliability is paramount. This model incorporated features that emphasized fault tolerance and stability, ensuring that systems relying on it could maintain operational integrity even in the event of component failures. The 80960HA showcased enhanced error detection and correction capabilities, which contributed to its reputation as a dependable choice for mission-critical applications.

On the other hand, the 80960HT was designed to meet the needs of high-performance telecommunications and networking applications. Recognized for its ability to handle multiple tasks concurrently, the 80960HT included advanced features such as built-in support for multitasking and real-time processing. This made it an excellent fit for applications that demanded rapid data handling and processing, such as routers and switches in networking environments. Its architecture allowed for efficient context switching, ensuring that multiple processes could execute seamlessly.

All three variants utilized the same family architecture, enabling easy integration and compatibility across different applications. They also supported various memory management techniques, such as virtual memory and caching, enhancing their performance in diverse operating conditions. With their combination of high processing power, reliability, and flexibility, the Intel 80960 family of microprocessors played a crucial role in advancing embedded computing technologies, paving the way for modern-day processors and systems. The 80960 series remains a noteworthy chapter in the evolution of microprocessor design, reflecting the growing demands of the computing landscape during its time.
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