Intel 632xESB, 631xESB Thermal Specifications, Thermal Design Power TDP, Die Case Temperature

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Thermal Specifications—Intel®6321ESB ICH

3.0Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the Intel® 6321ESB I/O Controller Hub component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3. Flip chip ball grid array (FC-BGA) packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the Intel® 6321ESB I/O Controller Hub component.

3.2Die Case Temperature

To ensure proper operation and reliability of the Intel® 6321ESB I/O Controller Hub component, the die temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Chapter 6.0 for guidelines on accurately measuring package die temperatures.

Table 3. Intel® 6321ESB I/O Controller Hub Thermal Specifications

Parameter

Value

Notes

 

 

 

Tcase_max

105°C

 

 

 

 

Tcase_min

5°C

 

 

 

 

TDP

12.4W

 

 

 

 

Note: These specifications are based on silicon characterization; however, they may be updated as further data becomes available.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 11

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Contents February Thermal and Mechanical Design GuidelinesPage Contents 001 Initial public release Revision HistoryTables Date Revision DescriptionDesign Flow IntroductionThermal Design Process Term Definition Definition of TermsReference Documents Definition of TermsTitle Location Referenced DocumentsPackaging Technology Intel 6321ESB I/O Controller Hub Package Dimensions Top ViewIntel 6321ESB ICH-Packaging Technology Intel 6321ESB I/O Controller Hub Thermal Specifications Thermal SpecificationsThermal Design Power TDP Die Case TemperatureThermal Simulation Characterizing the Thermal Solution Requirement Thermal Solution RequirementsExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter RelationshipsHub @ 12.4 W Required Heat Sink Thermal Performance ΨCADevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Zero Degree Angle Attach Methodology Die Case Temperature MeasurementsThermal Metrology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Torsional Clip Heatsink Board Component Keepout Heatsink OrientationThermal Interface Material Mechanical Interface MaterialPressure on IHSpsi End of Line End of Life Heatsink ClipClip Retention Anchors Thermal Resistance C × in 2/WTest Requirement Pass/Fail Criteria Reliability Guidelines§ § Reliability GuidelinesTorsional Clip Heatsink Thermal Solution Appendix a Thermal Solution Component SuppliersDrawing Description Appendix B Mechanical DrawingsMechanical Drawing List Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing
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