Intel 631xESB, 632xESB manual Thermal Metrology, Die Case Temperature Measurements

Page 16

Intel® 6321ESB ICH—Thermal Metrology

6.0Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the Intel® 6321ESB I/O Controller Hub die temperatures. Section 6.1 provides guidelines on how to accurately measure the Intel® 6321ESB ICH die temperatures. The flowchart in Figure 6 offers useful guidelines for thermal performance and evaluation.

6.1Die Case Temperature Measurements

To ensure functionality and reliability, the Tcase of the Intel® 6321ESB ICH must be maintained at or between the maximum/minimum operating range of the temperature specification as noted in Table 3. The surface temperature at the geometric center of the die corresponds to Tcase. Measuring Tcase requires special care to ensure an accurate temperature measurement.

Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce errors in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, and/or contact between the thermocouple cement and the heatsink base. For maximize measurement accuracy, only the 0° thermocouple attach approach is recommended.

6.1.1Zero Degree Angle Attach Methodology

1.Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of the heatsink base.

2.Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 7).

3.Attach thermal interface material (TIM) to the bottom of the heatsink base.

4.Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base.

5.Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement. During this step, ensure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 8).

6.Attach heatsink assembly to the MCH and route thermocouple wires out through the milled slot.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 16

Page 15 Page 17
Image 16
Page 15 Page 17
Contents Thermal and Mechanical Design Guidelines FebruaryPage Contents Revision History TablesDate Revision Description 001 Initial public releaseIntroduction Design FlowThermal Design Process Definition of Terms Reference DocumentsDefinition of Terms Term DefinitionReferenced Documents Title LocationIntel 6321ESB I/O Controller Hub Package Dimensions Top View Packaging TechnologyIntel 6321ESB ICH-Packaging Technology Thermal Specifications Thermal Design Power TDPDie Case Temperature Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Thermal Solution Requirements Characterizing the Thermal Solution RequirementProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceDevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Required Heat Sink Thermal Performance ΨCAHub @ 12.4 W Thermal Metrology Die Case Temperature MeasurementsZero Degree Angle Attach Methodology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Operating Environment Reference Thermal SolutionHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Heatsink Orientation Torsional Clip Heatsink Board Component KeepoutMechanical Interface Material Thermal Interface MaterialHeatsink Clip Clip Retention AnchorsThermal Resistance C × in 2/W Pressure on IHSpsi End of Line End of LifeReliability Guidelines § §Reliability Guidelines Test Requirement Pass/Fail CriteriaAppendix a Thermal Solution Component Suppliers Torsional Clip Heatsink Thermal SolutionMechanical Drawing List Appendix B Mechanical DrawingsDrawing Description Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing
Top Page Image Contents