Intel 632xESB, 631xESB manual Definition of Terms, Reference Documents, Term Definition

Page 7

Introduction—Intel®6321ESB ICH

1.2Definition of Terms

Table 1.

Definition of Terms

 

 

 

 

 

Term

Definition

 

 

 

 

 

Bond line thickness. Final settled thickness of the

 

BLT

thermal interface material after installation of

 

 

heatsink.

 

 

 

 

 

Flip Chip Ball Grid Array. A ball grid array packaging

 

FCBGA

technology where the die is exposed on the package

 

 

substrate.

 

 

 

 

 

The chipset component that integrates an Ultra ATA

 

 

100 controller, six Serial ATA host controller ports,

 

 

one EHCI host controller supporting eight external

 

Intel® 6321ESB I/O Controller Hub

USB 2.0 ports, LPC interface controller, flash BIOS

 

interface controller, PCI/PCI-X interface controller,

 

 

 

 

PCI Express interface, BMC controller, Azalia / AC'97

 

 

digital controller, integrated LAN controller, an ASF

 

 

controller and a ESI for communication with the MCH.

 

 

 

 

 

Linear Feet Per Minute. A measure of airflow emitted

 

LFM

from a forced convection device, such as an axial fan

 

 

or blower.

 

 

 

 

 

Memory controller hub. The chipset component that

 

MCH

contains the processor interface, the memory

 

 

interface, and the South Bridge Interface.

 

 

 

 

 

Maximum die temperature allowed. This temperature

 

Tcase-max

is measured at the geometric center of the top of the

 

 

package die.

 

 

 

 

 

Minimum die temperature allowed. This temperature

 

Tcase-min

is measured at the geometric center of the top of the

 

 

package die.

 

 

 

 

 

Thermal Design Power. Thermal solutions should be

 

TDP

designed to dissipate this target power level. TDP is

 

not the maximum power that the chipset can

 

 

 

 

dissipate.

 

 

 

 

 

Case-to-ambient thermal characterization parameter.

 

 

A measure of the thermal solution thermal

 

 

performance including the TIM using total package

 

ΨCA

power. Defined as (TCASE – TLA) / Total Package

 

 

Power.

 

 

Note: Heat source must be specified when using Ψ

 

 

calculations.

 

 

 

 

 

Case-to-Sink thermal characterization parameter. A

 

 

measure of the thermal interface material

 

ΨCS

performance using total package power. Defined as

 

(TCASE - TSINK)/ Total Package Power.

 

 

Note: Heat source must be specified when using Ψ

 

 

calculations.

 

 

 

 

 

Sink-to-Ambient thermal characterization parameter.

 

 

A measure of the heat sink performance using total

 

ΨSA

package power. Defined as (TSINK - TLA)/Total

 

Package Power.

 

 

Note: Heat source must be specified when using Ψ

 

 

calculations.

 

 

 

1.3

Reference Documents

 

The reader of this specification should also be familiar with material and concepts

 

presented in the following documents:

 

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007

TMDG

 

7

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Contents February Thermal and Mechanical Design GuidelinesPage Contents 001 Initial public release Revision HistoryTables Date Revision DescriptionDesign Flow IntroductionThermal Design Process Term Definition Definition of TermsReference Documents Definition of TermsTitle Location Referenced DocumentsPackaging Technology Intel 6321ESB I/O Controller Hub Package Dimensions Top ViewIntel 6321ESB ICH-Packaging Technology Intel 6321ESB I/O Controller Hub Thermal Specifications Thermal SpecificationsThermal Design Power TDP Die Case TemperatureThermal Simulation Characterizing the Thermal Solution Requirement Thermal Solution RequirementsExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter RelationshipsDevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Required Heat Sink Thermal Performance ΨCAHub @ 12.4 W Thermal Metrology Die Case Temperature MeasurementsZero Degree Angle Attach Methodology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Operating Environment Reference Thermal SolutionHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Torsional Clip Heatsink Board Component Keepout Heatsink OrientationThermal Interface Material Mechanical Interface MaterialPressure on IHSpsi End of Line End of Life Heatsink ClipClip Retention Anchors Thermal Resistance C × in 2/WTest Requirement Pass/Fail Criteria Reliability Guidelines§ § Reliability GuidelinesTorsional Clip Heatsink Thermal Solution Appendix a Thermal Solution Component SuppliersMechanical Drawing List Appendix B Mechanical DrawingsDrawing Description Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing