Intel 632xESB, 631xESB manual Heatsink Clip, Clip Retention Anchors, Thermal Resistance C × in 2/W

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Reference Thermal Solution—Intel®6321ESB ICH

Life value is the predicted TIM performance when the product and TIM reaches the end of its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line thermal resistance of 0.345 °C x in2/W and End of Life thermal resistance of 0.459°C in2/W.

Table 5. Honeywell PCM45 F TIM Performance as a Function of Attach Pressure

 

 

Thermal Resistance (°C × in2)/W

Pressure on IHS(psi)

 

 

 

 

End of Line End of Life

End of Line End of Life

 

 

 

 

2.18

 

0.391

0.551

 

 

 

 

4.35

 

0.345

0.459

 

 

 

 

Note:

All measured at 50ºC.

 

7.5.4Heatsink Clip

The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten the clip to the board. See Appendix B, “Mechanical Drawings” for a mechanical drawing of the clip.

7.5.5Clip Retention Anchors

For Intel® 6321ESB I/O Controller Hub-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability over time. See Appendix A, “Thermal Solution Component Suppliers” for the part number and supplier information.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 25

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Contents February Thermal and Mechanical Design GuidelinesPage Contents Tables Revision HistoryDate Revision Description 001 Initial public releaseDesign Flow IntroductionThermal Design Process Reference Documents Definition of TermsDefinition of Terms Term DefinitionTitle Location Referenced DocumentsPackaging Technology Intel 6321ESB I/O Controller Hub Package Dimensions Top ViewIntel 6321ESB ICH-Packaging Technology Thermal Design Power TDP Thermal SpecificationsDie Case Temperature Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Characterizing the Thermal Solution Requirement Thermal Solution RequirementsExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter RelationshipsDevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Required Heat Sink Thermal Performance ΨCAHub @ 12.4 W Thermal Metrology Die Case Temperature MeasurementsZero Degree Angle Attach Methodology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Operating Environment Reference Thermal SolutionHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Torsional Clip Heatsink Board Component Keepout Heatsink OrientationThermal Interface Material Mechanical Interface MaterialClip Retention Anchors Heatsink ClipThermal Resistance C × in 2/W Pressure on IHSpsi End of Line End of Life§ § Reliability GuidelinesReliability Guidelines Test Requirement Pass/Fail CriteriaTorsional Clip Heatsink Thermal Solution Appendix a Thermal Solution Component SuppliersMechanical Drawing List Appendix B Mechanical DrawingsDrawing Description Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing
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