Intel 631xESB, 632xESB manual Thermal Simulation

Page 12

Intel® 6321ESB ICH—Thermal Simulation

4.0Thermal Simulation

Intel provides thermal simulation models of the Intel® 6321ESB I/O Controller Hub component and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool Flotherm* (version 5.1 or higher) by Flomerics, Inc*. These models are also available in IcePak* format. Contact your Intel field sales representative to order the thermal models and user's guides.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 12

Image 12

Contents Thermal and Mechanical Design Guidelines FebruaryPage Contents Revision History TablesDate Revision Description 001 Initial public releaseIntroduction Design FlowThermal Design Process Definition of Terms Reference DocumentsDefinition of Terms Term DefinitionReferenced Documents Title LocationIntel 6321ESB I/O Controller Hub Package Dimensions Top View Packaging TechnologyIntel 6321ESB ICH-Packaging Technology Thermal Specifications Thermal Design Power TDPDie Case Temperature Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Thermal Solution Requirements Characterizing the Thermal Solution RequirementProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceRequired Heat Sink Thermal Performance ΨCA Device CA º C/W at T LA = 45º C CA º C/W at T LA = 65º CHub @ 12.4 W Die Case Temperature Measurements Thermal MetrologyZero Degree Angle Attach Methodology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Reference Thermal Solution Operating EnvironmentHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Heatsink Orientation Torsional Clip Heatsink Board Component KeepoutMechanical Interface Material Thermal Interface MaterialHeatsink Clip Clip Retention AnchorsThermal Resistance C × in 2/W Pressure on IHSpsi End of Line End of LifeReliability Guidelines § §Reliability Guidelines Test Requirement Pass/Fail CriteriaAppendix a Thermal Solution Component Suppliers Torsional Clip Heatsink Thermal SolutionAppendix B Mechanical Drawings Mechanical Drawing ListDrawing Description Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing