Intel 631xESB, 632xESB manual Mechanical Design Envelope

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Intel® 6321ESB ICH—Reference Thermal Solution

Figure 9. Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target at 65C Local-Ambient

	8.000
	7.000
[C/W]							Thermal Target
	6.000						Simulation results with
							Simulation results with
2.3 sigma)							EOLife TIM performance
	5.000
	4.000
plus	4.000
plus
-ca (mean	3.000
-ca (mean	2.000
Psi	2.000
Psi
	1.000
	0.000
	0	50	100	150	200	250	300	350	400

LFM through fin area

7.3Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the Intel® 6321ESB ICH thermal solution are shown in Figure 10.

When using heatsinks that extend beyond the Intel® 6321ESB I/O Controller Hub reference heatsink envelope shown in Figure 10, any motherboard components placed between the heatsink and motherboard cannot exceed 2.46 mm (0.10 in.) in height.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 20

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Contents Thermal and Mechanical Design Guidelines FebruaryPage Contents Revision History TablesDate Revision Description 001 Initial public releaseIntroduction Design FlowThermal Design Process Definition of Terms Reference DocumentsDefinition of Terms Term DefinitionReferenced Documents Title LocationIntel 6321ESB I/O Controller Hub Package Dimensions Top View Packaging TechnologyIntel 6321ESB ICH-Packaging Technology Thermal Specifications Thermal Design Power TDPDie Case Temperature Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Thermal Solution Requirements Characterizing the Thermal Solution RequirementProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceHub @ 12.4 W Required Heat Sink Thermal Performance ΨCADevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Zero Degree Angle Attach Methodology Die Case Temperature MeasurementsThermal Metrology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Heatsink Orientation Torsional Clip Heatsink Board Component KeepoutMechanical Interface Material Thermal Interface MaterialHeatsink Clip Clip Retention AnchorsThermal Resistance C × in 2/W Pressure on IHSpsi End of Line End of LifeReliability Guidelines § §Reliability Guidelines Test Requirement Pass/Fail CriteriaAppendix a Thermal Solution Component Suppliers Torsional Clip Heatsink Thermal SolutionDrawing Description Appendix B Mechanical DrawingsMechanical Drawing List Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing