Intel 631xESB, 632xESB manual Referenced Documents, Title Location

Page 8

Intel® 6321ESB ICH—Introduction

Table 2.

Referenced Documents

 

 

 

 

 

Title

Location

 

 

 

 

Intel® 631xESB / 632xESB I/O Controller Hub Datasheet

http://www.intel.com/design/

 

chipsets/datashts/313082.htm

 

 

 

 

 

 

Intel® 631xESB / 632xESB I/O Controller Hub Specification Update

http://www.intel.com/design/

 

chipsets/specupdt/313075.htm

 

 

 

 

 

 

Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical

Reference# 31307301

 

Design Guide

 

 

 

 

 

 

Intel® 6700PXH 64-bit PCI Hub/6702PXH 64-bit PCI Hub (PXH/PXH-

http://www.intel.com/design/

 

V) Thermal Mechanical Design Guidelines

chipsets/designex/302817.htm

 

 

 

 

Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet

http://www.intel.com/design/

 

chipsets/datashts/302628.htm

 

 

 

 

 

 

BGA/OLGA Assembly Development Guide

 

 

 

 

 

Various system thermal design suggestions

http://www.formfactors.org

 

 

 

1.Unless otherwise specified, these documents are available through your Intel field sales representative. Some documents may not be available at this time.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 8

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Contents Thermal and Mechanical Design Guidelines FebruaryPage Contents Revision History TablesDate Revision Description 001 Initial public releaseIntroduction Design FlowThermal Design Process Definition of Terms Reference DocumentsDefinition of Terms Term DefinitionReferenced Documents Title LocationIntel 6321ESB I/O Controller Hub Package Dimensions Top View Packaging TechnologyIntel 6321ESB ICH-Packaging Technology Thermal Specifications Thermal Design Power TDPDie Case Temperature Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Thermal Solution Requirements Characterizing the Thermal Solution RequirementProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceHub @ 12.4 W Required Heat Sink Thermal Performance ΨCADevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Zero Degree Angle Attach Methodology Die Case Temperature MeasurementsThermal Metrology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Heatsink Orientation Torsional Clip Heatsink Board Component KeepoutMechanical Interface Material Thermal Interface MaterialHeatsink Clip Clip Retention AnchorsThermal Resistance C × in 2/W Pressure on IHSpsi End of Line End of LifeReliability Guidelines § §Reliability Guidelines Test Requirement Pass/Fail CriteriaAppendix a Thermal Solution Component Suppliers Torsional Clip Heatsink Thermal SolutionDrawing Description Appendix B Mechanical DrawingsMechanical Drawing List Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing
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