Intel 632xESB, 631xESB Reference Thermal Solution, Operating Environment, Heatsink Performance

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Reference Thermal Solution—Intel®6321ESB ICH

7.0Reference Thermal Solution

Intel has developed one reference thermal solution to meet the cooling needs of the Intel® 6321ESB I/O Controller Hub component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the Torsional Clip Heatsink reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions, depending on your specific system local-ambient operating conditions.

7.1Operating Environment

The Intel® 6321ESB ICH reference thermal solution was designed assuming a maximum local-ambient temperature of 65°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is 150 linear feet per minute (LFM). The approaching airflow temperature is assumed to be equal to the local- ambient temperature. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate. These local-ambient conditions are based on a 55°C external-ambient temperature at sea level. (External-ambient refers to the environment external to the system.)

7.2Heatsink Performance

Figure 9 depicts the measured thermal performance of the reference thermal solution versus approach air velocity. Since this data was measured at sea level, a correction factor would be required to estimate thermal performance at other altitudes.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

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Contents February Thermal and Mechanical Design GuidelinesPage Contents 001 Initial public release Revision HistoryTables Date Revision DescriptionDesign Flow IntroductionThermal Design Process Term Definition Definition of TermsReference Documents Definition of TermsTitle Location Referenced DocumentsPackaging Technology Intel 6321ESB I/O Controller Hub Package Dimensions Top ViewIntel 6321ESB ICH-Packaging Technology Intel 6321ESB I/O Controller Hub Thermal Specifications Thermal SpecificationsThermal Design Power TDP Die Case TemperatureThermal Simulation Characterizing the Thermal Solution Requirement Thermal Solution RequirementsExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter RelationshipsDevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Required Heat Sink Thermal Performance ΨCAHub @ 12.4 W Thermal Metrology Die Case Temperature MeasurementsZero Degree Angle Attach Methodology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Operating Environment Reference Thermal SolutionHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Torsional Clip Heatsink Board Component Keepout Heatsink OrientationThermal Interface Material Mechanical Interface MaterialPressure on IHSpsi End of Line End of Life Heatsink ClipClip Retention Anchors Thermal Resistance C × in 2/WTest Requirement Pass/Fail Criteria Reliability Guidelines§ § Reliability GuidelinesTorsional Clip Heatsink Thermal Solution Appendix a Thermal Solution Component SuppliersMechanical Drawing List Appendix B Mechanical DrawingsDrawing Description Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing
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