Intel 632xESB, 631xESB manual Introduction, Design Flow

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Introduction—Intel®6321ESB ICH

1.0Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

•Outline the thermal and mechanical operating limits and specifications for the Intel® 6321ESB I/O Controller Hub.

•Describe a reference thermal solution that meets the specification of Intel® 6321ESB I/O Controller Hub in Embedded applications.

Properly designed thermal solutions provide adequate cooling to maintain the Intel® 6321ESB I/O Controller Hub component die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the Intel® 6321ESB I/O Controller Hub component die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel® 6321ESB I/O Controller Hub component only. For thermal design information on other chipset components, refer to the respective component datasheet.

1.1Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1 illustrates the design process implicit to this document and the tools appropriate for each step.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 5

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Contents February Thermal and Mechanical Design GuidelinesPage Contents Tables Revision HistoryDate Revision Description 001 Initial public releaseDesign Flow IntroductionThermal Design Process Reference Documents Definition of TermsDefinition of Terms Term DefinitionTitle Location Referenced DocumentsPackaging Technology Intel 6321ESB I/O Controller Hub Package Dimensions Top ViewIntel 6321ESB ICH-Packaging Technology Thermal Design Power TDP Thermal SpecificationsDie Case Temperature Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Characterizing the Thermal Solution Requirement Thermal Solution RequirementsExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter RelationshipsHub @ 12.4 W Required Heat Sink Thermal Performance ΨCADevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Zero Degree Angle Attach Methodology Die Case Temperature MeasurementsThermal Metrology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Torsional Clip Heatsink Board Component Keepout Heatsink OrientationThermal Interface Material Mechanical Interface MaterialClip Retention Anchors Heatsink ClipThermal Resistance C × in 2/W Pressure on IHSpsi End of Line End of Life§ § Reliability GuidelinesReliability Guidelines Test Requirement Pass/Fail CriteriaTorsional Clip Heatsink Thermal Solution Appendix a Thermal Solution Component SuppliersDrawing Description Appendix B Mechanical DrawingsMechanical Drawing List Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing
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