Intel 631xESB, 632xESB manual Mechanical Interface Material, Thermal Interface Material

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Intel® 6321ESB ICH—Reference Thermal Solution

Figure 12. Torsional Clip Heatsink Assembly

7.5.2Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

7.5.3Thermal Interface Material

A Thermal Interface Material (TIM) provides improved conductivity between the die and heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.254 mm (0.010 in.) thick, 15 mm x 15 mm (0.59 in. x 0.59 in.) square.

Note: Unflowed or "dry" Honewell PCM-45F has a material thickness of 0.010 inch. The flowed or "wet" Honeywell PCM-45F has a material thickness of ~0.003 inch after it reaches its phase change temperature.

7.5.3.1Effect of Pressure on TIM Performance

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F TIM is shown in Table 5.

Intel provides both End of Line and End of Life TIM thermal resistance values of Honeywell PCM45F. End of Line and End of Life TIM thermal resistance values are obtained through measurement on a Test Vehicle similar to the Intel® 631xESB/ 632xESB I/O's physical attributes using an extruded aluminum heatsink. The End of Line value represents the TIM performance post heatsink assembly while the End of

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

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Contents Thermal and Mechanical Design Guidelines FebruaryPage Contents Revision History TablesDate Revision Description 001 Initial public releaseIntroduction Design FlowThermal Design Process Definition of Terms Reference DocumentsDefinition of Terms Term DefinitionReferenced Documents Title LocationIntel 6321ESB I/O Controller Hub Package Dimensions Top View Packaging TechnologyIntel 6321ESB ICH-Packaging Technology Thermal Specifications Thermal Design Power TDPDie Case Temperature Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Thermal Solution Requirements Characterizing the Thermal Solution RequirementProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceRequired Heat Sink Thermal Performance ΨCA Device CA º C/W at T LA = 45º C CA º C/W at T LA = 65º CHub @ 12.4 W Die Case Temperature Measurements Thermal MetrologyZero Degree Angle Attach Methodology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Reference Thermal Solution Operating EnvironmentHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Heatsink Orientation Torsional Clip Heatsink Board Component KeepoutMechanical Interface Material Thermal Interface MaterialHeatsink Clip Clip Retention AnchorsThermal Resistance C × in 2/W Pressure on IHSpsi End of Line End of LifeReliability Guidelines § §Reliability Guidelines Test Requirement Pass/Fail CriteriaAppendix a Thermal Solution Component Suppliers Torsional Clip Heatsink Thermal SolutionAppendix B Mechanical Drawings Mechanical Drawing ListDrawing Description Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing
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