Intel 632xESB, 631xESB manual Required Heat Sink Thermal Performance ΨCA, Hub @ 12.4 W

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Thermal Solution Requirements—Intel®6321ESB ICH

C ΨSA = ΨCA – ΨCS = 3.23 – 0.35 = 2.88°---

W

If the local ambient temperature is relaxed to 45° C, the same calculation can be carried out to determine the new case-to-ambient thermal resistance:

ΨCA =

TC – TLA

 

105 – 45

C

-----TDP------------

=

----12.4----------

= 4.84°W---

It is evident from the above calculations that a reduction in the local ambient temperature has a significant effect on the case-to-ambient thermal resistance requirement. This effect can contribute to a more reasonable thermal solution including reduced cost, heat sink size, heat sink weight, and a lower system airflow rate.

Table 4 summarizes the thermal budget required to adequately cool the Intel® 6321ESB I/O Controller Hub in one configuration using a TDP of 12.4 W. Further calculations would need to be performed for different TDPs. Since the results are based on air data at sea level, a correction factor would be required to estimate the thermal performance at other altitudes.

Table 4. Required Heat Sink Thermal Performance (ΨCA)

Device

ΨCA (º C/W) at TLA = 45º C

ΨCA (º C/W) at TLA = 65º C

 

 

 

Intel® 6321ESB I/O Controller

4.84

3.23

Hub @ 12.4 W

 

 

 

 

 

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 15

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Contents February Thermal and Mechanical Design GuidelinesPage Contents 001 Initial public release Revision HistoryTables Date Revision DescriptionDesign Flow IntroductionThermal Design Process Term Definition Definition of TermsReference Documents Definition of TermsTitle Location Referenced DocumentsPackaging Technology Intel 6321ESB I/O Controller Hub Package Dimensions Top ViewIntel 6321ESB ICH-Packaging Technology Intel 6321ESB I/O Controller Hub Thermal Specifications Thermal SpecificationsThermal Design Power TDP Die Case TemperatureThermal Simulation Characterizing the Thermal Solution Requirement Thermal Solution RequirementsExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter RelationshipsRequired Heat Sink Thermal Performance ΨCA Device CA º C/W at T LA = 45º C CA º C/W at T LA = 65º CHub @ 12.4 W Die Case Temperature Measurements Thermal MetrologyZero Degree Angle Attach Methodology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Reference Thermal Solution Operating EnvironmentHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Torsional Clip Heatsink Board Component Keepout Heatsink OrientationThermal Interface Material Mechanical Interface MaterialPressure on IHSpsi End of Line End of Life Heatsink ClipClip Retention Anchors Thermal Resistance C × in 2/WTest Requirement Pass/Fail Criteria Reliability Guidelines§ § Reliability GuidelinesTorsional Clip Heatsink Thermal Solution Appendix a Thermal Solution Component SuppliersAppendix B Mechanical Drawings Mechanical Drawing ListDrawing Description Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing
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