Thermal Solution Component
Appendix A Thermal Solution Component Suppliers
A.1 Torsional Clip Heatsink Thermal Solution
Part | Intel Part | Supplier | Contact Information | |
Number | (Part Number) | |||
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AdvancedTCA* and |
| Wendy Lin | ||
Embedded Form Factor Heat | N/A | |||
(Aluminum) | ||||
Sink |
| Wendy@coolermaster.com | ||
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Thermal Interface |
| Honeywell* | Paula Knoll | |
N/A | ||||
(PCM45F) | PCM45F | |||
| paula.knoll@honeywell.com | |||
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| Harry Lin (USA) | |
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Heatsink Attach Clip | CCI/ACK | hlinack@aol.com | ||
Monica Chih (Taiwan) | ||||
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| monica_chih@ccic.com.tw | |
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| Bob Hall (USA) | |
Heat Sink Attach Clip | Foxconn* | |||
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| bhall@foxconn.com | |
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| Foxconn | Julia Jiang (USA) | |
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| juliaj@foxconn.com | ||
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Note: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability.
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007TMDG 27