Intel 631xESB, 632xESB manual Processor Thermal Characterization Parameter Relationships

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Intel® 6321ESB ICH—Thermal Solution Requirements

Figure 5. Processor Thermal Characterization Parameter Relationships

TA

HEATSINK

TIM TS

TC

Device

ΨSA

ΨCS

ΨCA

Example 1. Calculating the Required Thermal Performance

The cooling performance, ΨCA, is defined using the thermal characterization parameter previously described. The process to determine the required thermal performance to cool the device includes:

1.Define a target component temperature TCASE and corresponding TDP.

2.Define a target local ambient temperature, TLA.

3.Use Equation 1 and Equation 2 to determine the required thermal performance needed to cool the device.

The following provides an example of how you might determine the appropriate performance targets.

Assume:

•TDP = 12.4 W and TCASE = 105° C

•Local processor ambient temperature, TLA = 65° C.

Then the following could be calculated using Equation 1 for the given chipset configuration:

ΨCA =

TCASE – TLA

 

105 – 65

 

C

----------TDP---------------

=

----12.4----------

=

3.23°W---

To determine the required heat sink performance, a heat sink solution provider would need to determine ΨCS performance for the selected TIM and mechanical load configuration. If the heat sink solution were designed to work with a TIM material performing at ΨCS ≤ 0.35 °C/W, solving from Equation 2, the performance needed from the heat sink is:

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

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Contents Thermal and Mechanical Design Guidelines FebruaryPage Contents Date Revision Description Revision HistoryTables 001 Initial public releaseIntroduction Design FlowThermal Design Process Definition of Terms Definition of TermsReference Documents Term DefinitionReferenced Documents Title LocationIntel 6321ESB I/O Controller Hub Package Dimensions Top View Packaging TechnologyIntel 6321ESB ICH-Packaging Technology Die Case Temperature Thermal SpecificationsThermal Design Power TDP Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Thermal Solution Requirements Characterizing the Thermal Solution RequirementProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceHub @ 12.4 W Required Heat Sink Thermal Performance ΨCADevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Zero Degree Angle Attach Methodology Die Case Temperature MeasurementsThermal Metrology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Heatsink Orientation Torsional Clip Heatsink Board Component KeepoutMechanical Interface Material Thermal Interface MaterialThermal Resistance C × in 2/W Heatsink ClipClip Retention Anchors Pressure on IHSpsi End of Line End of LifeReliability Guidelines Reliability Guidelines§ § Test Requirement Pass/Fail CriteriaAppendix a Thermal Solution Component Suppliers Torsional Clip Heatsink Thermal SolutionDrawing Description Appendix B Mechanical DrawingsMechanical Drawing List Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing
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