Intel 631xESB, 632xESB manual Reliability Guidelines, § §, Test Requirement Pass/Fail Criteria

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Intel® 6321ESB ICH—Reliability Guidelines

8.0Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 6.

Table 6.	Reliability Guidelines

	Test (1)	Requirement	Pass/Fail Criteria (2)

	Mechanical Shock	50 g, board level, 11 msec, 3 shocks/axis	Visual Check and Electrical Functional Test

	Random Vibration	7.3 g, board level, 45 min/axis, 50 Hz to	Visual Check and Electrical Functional Test
	Random Vibration	2000 Hz	Visual Check and Electrical Functional Test
		2000 Hz

	Temperature Life	85°C, 2000 hours total, checkpoints at	Visual Check
	Temperature Life	168, 500, 1000, and 2000 hours	Visual Check
		168, 500, 1000, and 2000 hours

	Thermal Cycling	-5°C to +70°C, 500 cycles	Visual Check

	Humidity	85% relative humidity, 55°C, 1000 hours	Visual Check

Notes:

1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

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Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 26

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Contents Thermal and Mechanical Design Guidelines FebruaryPage Contents Date Revision Description Revision HistoryTables 001 Initial public releaseIntroduction Design FlowThermal Design Process Definition of Terms Definition of TermsReference Documents Term DefinitionReferenced Documents Title LocationIntel 6321ESB I/O Controller Hub Package Dimensions Top View Packaging TechnologyIntel 6321ESB ICH-Packaging Technology Die Case Temperature Thermal SpecificationsThermal Design Power TDP Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Thermal Solution Requirements Characterizing the Thermal Solution RequirementProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceHub @ 12.4 W Required Heat Sink Thermal Performance ΨCADevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Zero Degree Angle Attach Methodology Die Case Temperature MeasurementsThermal Metrology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Heatsink Orientation Torsional Clip Heatsink Board Component KeepoutMechanical Interface Material Thermal Interface MaterialThermal Resistance C × in 2/W Heatsink ClipClip Retention Anchors Pressure on IHSpsi End of Line End of LifeReliability Guidelines Reliability Guidelines§ § Test Requirement Pass/Fail CriteriaAppendix a Thermal Solution Component Suppliers Torsional Clip Heatsink Thermal SolutionDrawing Description Appendix B Mechanical DrawingsMechanical Drawing List Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing