Intel 632xESB, 631xESB manual Board-Level Components Keepout Dimensions

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Reference Thermal Solution—Intel®6321ESB ICH

Figure 10. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O Controller Hub

	ESB2		mm
			mm
	Passive		mm.
	Passive	4..2.3030mm61 m.	33.
	Heatsink		33.
	Heatsink		21.
			21.
			33.30
		4
	Die + TIM
	FCBGA + Solder Balls
	Motherboard
	42..30mm.
	TNB
	Heatsink
	ESB2	mm
		mm
	Passive	mm.
	Passive	42.30 42.30
	Heatsink	42.30 42.30

7.4Board-Level Components Keepout Dimensions

The location of holes pattern and keepout zones for the reference thermal solution are shown in Figure 11. This reference thermal solution has the same mounting hole pattern as that of the Intel® E7500/E7501/E7505 chipset.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 21

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Contents February Thermal and Mechanical Design GuidelinesPage Contents Tables Revision HistoryDate Revision Description 001 Initial public releaseDesign Flow IntroductionThermal Design Process Reference Documents Definition of TermsDefinition of Terms Term DefinitionTitle Location Referenced DocumentsPackaging Technology Intel 6321ESB I/O Controller Hub Package Dimensions Top ViewIntel 6321ESB ICH-Packaging Technology Thermal Design Power TDP Thermal SpecificationsDie Case Temperature Intel 6321ESB I/O Controller Hub Thermal SpecificationsThermal Simulation Characterizing the Thermal Solution Requirement Thermal Solution RequirementsExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter RelationshipsRequired Heat Sink Thermal Performance ΨCA Device CA º C/W at T LA = 45º C CA º C/W at T LA = 65º CHub @ 12.4 W Die Case Temperature Measurements Thermal MetrologyZero Degree Angle Attach Methodology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Reference Thermal Solution Operating EnvironmentHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Torsional Clip Heatsink Board Component Keepout Heatsink OrientationThermal Interface Material Mechanical Interface MaterialClip Retention Anchors Heatsink ClipThermal Resistance C × in 2/W Pressure on IHSpsi End of Line End of Life§ § Reliability GuidelinesReliability Guidelines Test Requirement Pass/Fail CriteriaTorsional Clip Heatsink Thermal Solution Appendix a Thermal Solution Component SuppliersAppendix B Mechanical Drawings Mechanical Drawing ListDrawing Description Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing