Intel 632xESB Packaging Technology, Intel 6321ESB I/O Controller Hub Package Dimensions Top View

Packaging Technology—Intel®6321ESB ICH

2.0Packaging Technology

The Intel® 6321ESB I/O Controller Hub component uses a 40 mm x 40 mm, 10-layer FC-BGA3 package (see Figure 2 and Figure 3).

Figure 2. Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View)

			Die
Handling			Keepout
Exclusion	19.49mm.		Area
Area
10.78mm.		6.17mm.
20.19mm. 13.99mm.	ESB2	26.0mm.	30.0mm.	40.0mm.
	Die
3.10mm.
	26.0mm.
	30.0mm.
	40.0mm.

Figure 3. Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)

Substrate	Decoup
2.535 ± 0.123 mm			Die
	Cap
		0.84 ± 0.05 mm
2.100 ± 0.121 mm			0.7 mm Max	0.20 See note 4.
				0.20 –C–
0.435 ± 0.025 mm			Seating Plane
				See note 1.
See note 3
Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2.All dimensions and tolerances conform to ANSI Y14.5M-1994

3.BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 9