Cypress CY7C1150V18, CY7C1148V18, CY7C1146V18 manual Package Diagram, Ball Fbga 13 x 15 x 1.4 mm

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CY7C1146V18, CY7C1157V18

CY7C1148V18, CY7C1150V18

Package Diagram

Figure 8. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180

15.00±0.10

TOP VIEW

PIN 1 CORNER

15.00±0.10

BOTTOM VIEW

							PIN 1 CORNER
					Ø0.05 M C
						Ø0.25 M C A B
					Ø0.50		-0.06	(165X)
							+0.14
11	10	9	8	7	6	5	4	3	2	1
										A
										B
1.00										C
1.00										D
										D
										E
										F
14.00										G
14.00										H
										J
										K
7.00										L
7.00										M
										M

1.00

5.00

10.00

0.25 C

	B
0.53±0.05
0.36	C
0.36

13.00±0.10

		1.40MAX.

				0.15C

SEATING PLANE

0.35±0.06

B 13.00±0.10

0.15(4X)

NOTES :

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC

51-85180-*A

Document Number: 001-06621 Rev. *D

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Contents Selection Guide Functional Description FeaturesConfigurations Description 375 MHz 333 MHz 300 MHz UnitLogic Block Diagram CY7C1146V18 Logic Block Diagram CY7C1157V18Logic Block Diagram CY7C1148V18 Logic Block Diagram CY7C1150V18CY7C1157V18 2M x Pin ConfigurationsCY7C1146V18 2M x TMSBWS CY7C1148V18 1M xCY7C1150V18 512K x TMS TDISynchronous Read/Write Input. When Pin DefinitionsPin Name Pin Description Negative Input Clock InputTDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device TCK Pin for JtagFunctional Overview Master Truth TableSRAM#1 SRAM#2 OperationComments When the Data portion of a write sequence is activeWrite Cycle Descriptions Remains unalteredWritten into the device. D359 remains unaltered Write cycle descriptions of CY7C1148V18 follows, 3Written into the device Into the device. D80 and D3518 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram Shows the tap controller state diagramTAP Controller TAP Controller Block DiagramTAP Electrical Characteristics Parameter Description Test Conditions Min Max UnitTAP AC Switching Characteristics TAP Timing and Test ConditionInstruction Codes Identification Register DefinitionsScan Register Sizes Boundary Scan Order Bit # Bump IDPower Up Waveforms Power Up Sequence in DDR-II+ SramPower Up Sequence DLL ConstraintsOperating Range Electrical CharacteristicsMaximum Ratings AC Input RequirementsAC Test Loads and Waveforms CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitParameter Min Max Switching CharacteristicsCypress Consortium Description 375 MHz 333 MHz 300 MHz Unit DLL TimingNOP Switching WaveformsRead/Write/Deselect Sequence Read NOP WriteOrdering Information 300 Package Diagram Ball Fbga 13 x 15 x 1.4 mmNXR ECN No Issue Date Orig. Description of ChangeDocument History VKN/KKVTMP