Cypress CY7C1381F Maximum Ratings, Operating Range, Electrical Characteristics, Ambient Range

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CY7C1381D, CY7C1381F CY7C1383D, CY7C1383F

Maximum Ratings

Exceeding the maximum ratings may impair the useful life of the device. For user guidelines, not tested.

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.3V to +4.6V

Supply Voltage on VDDQ Relative to GND

–0.3V to +VDD

DC Voltage Applied to Outputs

–0.5V to VDDQ + 0.5V

in Tri-State

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

 

20 mA

Static Discharge Voltage

 

> 2001V

(per MIL-STD-883, Method 3015)

 

Latch-up Current

 

> 200 mA

Operating Range

 

 

 

 

 

 

 

Ambient

 

 

Range

Temperature

VDD

VDDQ

Commercial

0°C to +70°C

3.3V –5%/+10%

2.5V – 5%

 

 

 

to VDD

Industrial

–40°C to +85°C

 

Electrical Characteristics

Over the Operating Range [17, 18]

Parameter

Description

Test Conditions

Min

Max

Unit

VDD

Power Supply Voltage

 

 

3.135

3.6

V

VDDQ

IO Supply Voltage

for 3.3V IO

 

3.135

VDD

V

 

 

 

for 2.5V IO

 

2.375

2.625

V

VOH

Output HIGH Voltage

for 3.3V IO, IOH = –4.0 mA

 

2.4

 

V

 

 

 

for 2.5V IO, IOH = –1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

for 3.3V IO, IOL = 8.0 mA

 

 

0.4

V

 

 

 

for 2.5V IO, IOL = 1.0 mA

 

 

0.4

V

V

IH

Input HIGH Voltage [17]

for 3.3V IO

 

2.0

V + 0.3V

V

 

 

 

 

 

DD

 

 

 

 

for 2.5V IO

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage [17]

for 3.3V IO

 

–0.3

0.8

V

 

 

 

for 2.5V IO

 

–0.3

0.7

V

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

A

 

 

except ZZ and MODE

 

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

A

 

 

 

Input = VDD

 

 

5

A

 

 

Input Current of ZZ

Input = VSS

 

–5

 

A

 

 

 

Input = VDD

 

 

30

A

IOZ

Output Leakage Current

GND VI VDD, Output Disabled

 

–5

5

A

IDD

VDD Operating Supply

VDD = Max, IOUT = 0 mA,

7.5-ns cycle, 133 MHz

 

210

mA

 

 

Current

f = fMAX = 1/tCYC

 

 

 

 

 

 

10-ns cycle, 100 MHz

 

175

mA

ISB1

Automatic CE

Max VDD, Device Deselected,

7.5-ns cycle, 133 MHz

 

140

mA

 

 

Power Down

VIN VIH or VIN VIL, f = fMAX,

 

 

 

 

 

 

10-ns cycle, 100 MHz

 

120

 

 

 

Current—TTL Inputs

inputs switching

 

 

 

 

ISB2

Automatic CE

Max VDD, Device Deselected,

All speeds

 

70

mA

 

 

Power Down

VIN VDD – 0.3V or VIN 0.3V,

 

 

 

 

 

 

Current—CMOS Inputs

f = 0, inputs static

 

 

 

 

ISB3

Automatic CE

Max VDD, Device Deselected,

7.5-ns cycle, 133 MHz

 

130

mA

 

 

Power Down

VIN VDDQ – 0.3V or VIN 0.3V,

 

 

 

 

 

 

10-ns cycle, 100 MHz

 

110

mA

 

 

Current—CMOS Inputs

f = fMAX, inputs switching

 

 

 

 

ISB4

Automatic CE

Max VDD, Device Deselected,

All Speeds

 

80

mA

 

 

Power Down

VIN VDD – 0.3V or VIN 0.3V,

 

 

 

 

 

 

Current—TTL Inputs

f = 0, inputs static

 

 

 

 

Notes:

17.Overshoot: VIH(AC) < VDD +1.5V (pulse width less than tCYC/2), undershoot: VIL(AC) > –2V (pulse width less than tCYC/2).

18.Tpower up: Assumes a linear ramp from 0v to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

Document #: 38-05544 Rev. *F

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Contents 133 MHz 100 MHz Unit FeaturesSelection Guide Cypress Semiconductor CorporationCY7C1381D, CY7C1381F Pin Configurations Pin Tqfp Pinout 3 Chip Enable CY7C1381D 512K xCY7C1383D 1M x Pin Configurations Pin Configurations Ball Fbga Pinout3 Chip Enable Pin Definitions Name DescriptionByte write select inputs, active LOW. Qualified with Functional Overview Address Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics = GNDCycle Description Used CE1 CE2 CE3 Adsp Adsc ADV Write CLKDQPB, Dqpa Truth Table for Read/Write 4Function CY7C1381D/CY7C1381F DQPC, DqpaTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag Bypass Register TAP Instruction SetTAP AC Switching Characteristics TAP Timing5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions Parameter Description Conditions MinIdentification Codes Identification Register DefinitionsScan Register Sizes Bit Size ×36 Bit Size ×18Ball BGA Boundary Scan Order 14 Bit # Ball IDA11 Operating Range Electrical CharacteristicsMaximum Ratings Ambient RangeCapacitance Thermal ResistanceAC Test Loads and Waveforms Switching Characteristics 133 MHz 100 MHz Parameter Description Unit MinTiming Diagrams Read Cycle TimingWrite Cycle Timing 26 Address BWERead/Write Cycle Timing 26, 28 ADVZZ Mode Timing 30 Ordering Information Package Diagrams Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Date Orig. Description of Change Document History

CY7C1381D, CY7C1381F, CY7C1383D, CY7C1383F specifications

The Cypress CY7C1383F, CY7C1383D, CY7C1381F, and CY7C1381D are high-performance static random-access memory (SRAM) devices designed for a variety of applications requiring fast data storage and retrieval. These memory chips are part of the Cypress SRAM family, known for their low power consumption, high speed, and data integrity, making them suitable for use in telecommunications, networking, and industrial applications.

One of the standout features of the CY7C1383F and CY7C1383D models is their high density, offering 256K bits of memory. This provides ample space for storing critical data while maintaining excellent performance. The CY7C1381F and CY7C1381D variants, having a smaller capacity of 128K bits, are ideal for applications where space and power savings are paramount. All four devices are organized as 32K x 8 bits, promoting ease of integration into various designs.

These SRAM devices utilize advanced CMOS technology, which not only enhances their speed but also reduces power consumption. The fast access times, reaching as low as 10 nanoseconds for the CY7C1383F and CY7C1381F, enable high-speed data processing, making these memories suitable for cache applications and high-speed buffering. Overall, their performance characteristics ensure data can be accessed quickly and efficiently.

The CY7C1383F and CY7C1383D models come with an extended temperature range, ensuring consistent performance even in harsh environments. This reliability is critical for industrial applications where fluctuating temperatures can affect device functionality. Moreover, the CY7C1381F and CY7C1381D share this advantage, making all four components suitable for different operating conditions.

Built-in features such as byte-wide write enable and chip enable signals significantly ease the control of data access and manipulation. Additionally, the asynchronous nature of these SRAM devices allows for simple interfacing with various microcontrollers and processors, facilitating integration into existing systems with minimal design modifications.

In summary, the Cypress CY7C1383F, CY7C1383D, CY7C1381F, and CY7C1381D SRAM devices deliver high-performance data storage solutions, characterized by low power consumption, fast access times, and reliability in diverse operating conditions. Their versatility makes them an excellent choice for engineers seeking robust memory solutions in their designs.