Cypress CY7C1381D, CY7C1383F, CY7C1381F, CY7C1383D manual Ordering Information

Page 25

CY7C1381D, CY7C1381F

CY7C1383D, CY7C1383F

Ordering Information

Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered.

Speed

Ordering Code

Package

Part and Package Type

 

Operating

(MHz)

Diagram

 

Range

 

 

 

 

 

 

133

CY7C1381D-133AXC

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

 

Commercial

 

 

 

 

 

 

 

CY7C1383D-133AXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381F-133BGC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383F-133BGC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381F-133BGXC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383F-133BGXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-133BZC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383D-133BZC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-133BZXC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383D-133BZXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-133AXI

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

 

lndustrial

 

 

 

 

 

 

 

CY7C1383D-133AXI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381F-133BGI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383F-133BGI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381F-133BGXI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383F-133BGXI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-133BZI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383D-133BZI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-133BZXI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383D-133BZXI

 

 

 

 

 

 

 

 

 

 

100

CY7C1381D-100AXC

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

 

Commercial

 

 

 

 

 

 

 

CY7C1383D-100AXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381F-100BGC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383F-100BGC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381F-100BGXC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383F-100BGXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-100BZC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383D-100BZC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-100BZXC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383D-100BZXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-100AXI

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

 

lndustrial

 

 

 

 

 

 

 

CY7C1383D-100AXI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381F-100BGI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383F-100BGI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381F-100BGXI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383F-100BGXI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-100BZI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383D-100BZI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381D-100BZXI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383D-100BZXI

 

 

 

 

 

 

 

 

 

 

Document #: 38-05544 Rev. *F

 

 

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Contents Selection Guide Features133 MHz 100 MHz Unit Cypress Semiconductor CorporationCY7C1381D, CY7C1381F CY7C1381D 512K x Pin Configurations Pin Tqfp Pinout 3 Chip EnableCY7C1383D 1M x Pin Configurations Pin Configurations Ball Fbga Pinout3 Chip Enable Name Description Pin DefinitionsByte write select inputs, active LOW. Qualified with Functional Overview ZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDAddress = GNDCE1 CE2 CE3 Adsp Adsc ADV Write CLK Cycle Description UsedFunction CY7C1381D/CY7C1381F Truth Table for Read/Write 4DQPB, Dqpa DQPC, DqpaTAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterTAP Timing TAP AC Switching Characteristics3V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions Parameter Description Conditions MinScan Register Sizes Identification Register DefinitionsIdentification Codes Bit Size ×36 Bit Size ×18Bit # Ball ID Ball BGA Boundary Scan Order 14A11 Maximum Ratings Electrical CharacteristicsOperating Range Ambient RangeThermal Resistance CapacitanceAC Test Loads and Waveforms 133 MHz 100 MHz Parameter Description Unit Min Switching CharacteristicsRead Cycle Timing Timing DiagramsAddress BWE Write Cycle Timing 26ADV Read/Write Cycle Timing 26, 28ZZ Mode Timing 30 Ordering Information Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change

CY7C1381D, CY7C1381F, CY7C1383D, CY7C1383F specifications

The Cypress CY7C1383F, CY7C1383D, CY7C1381F, and CY7C1381D are high-performance static random-access memory (SRAM) devices designed for a variety of applications requiring fast data storage and retrieval. These memory chips are part of the Cypress SRAM family, known for their low power consumption, high speed, and data integrity, making them suitable for use in telecommunications, networking, and industrial applications.

One of the standout features of the CY7C1383F and CY7C1383D models is their high density, offering 256K bits of memory. This provides ample space for storing critical data while maintaining excellent performance. The CY7C1381F and CY7C1381D variants, having a smaller capacity of 128K bits, are ideal for applications where space and power savings are paramount. All four devices are organized as 32K x 8 bits, promoting ease of integration into various designs.

These SRAM devices utilize advanced CMOS technology, which not only enhances their speed but also reduces power consumption. The fast access times, reaching as low as 10 nanoseconds for the CY7C1383F and CY7C1381F, enable high-speed data processing, making these memories suitable for cache applications and high-speed buffering. Overall, their performance characteristics ensure data can be accessed quickly and efficiently.

The CY7C1383F and CY7C1383D models come with an extended temperature range, ensuring consistent performance even in harsh environments. This reliability is critical for industrial applications where fluctuating temperatures can affect device functionality. Moreover, the CY7C1381F and CY7C1381D share this advantage, making all four components suitable for different operating conditions.

Built-in features such as byte-wide write enable and chip enable signals significantly ease the control of data access and manipulation. Additionally, the asynchronous nature of these SRAM devices allows for simple interfacing with various microcontrollers and processors, facilitating integration into existing systems with minimal design modifications.

In summary, the Cypress CY7C1383F, CY7C1383D, CY7C1381F, and CY7C1381D SRAM devices deliver high-performance data storage solutions, characterized by low power consumption, fast access times, and reliability in diverse operating conditions. Their versatility makes them an excellent choice for engineers seeking robust memory solutions in their designs.