Cypress CY7C1356C, CY7C1354C manual Switching Characteristics Over the Operating Range 18

Page 19

CY7C1354C

CY7C1356C

Switching Characteristics Over the Operating Range [18, 19]

 

 

 

 

 

 

 

 

 

 

–250

–200

–166

 

Parameter

 

 

 

 

 

 

 

 

Description

 

 

 

 

 

 

Unit

 

 

 

 

 

 

 

 

Min.

Max.

Min.

Max.

Min.

Max.

 

 

 

 

 

 

 

 

 

 

tPower[17]

 

VCC (typical) to the First Access Read or Write

1

 

1

 

1

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

5

 

6

 

ns

FMAX

 

Maximum Operating Frequency

 

250

 

200

 

166

MHz

tCH

 

Clock HIGH

1.8

 

2.0

 

2.4

 

ns

tCL

 

Clock LOW

1.8

 

2.0

 

2.4

 

ns

tEOV

 

 

 

LOW to Output Valid

 

2.8

 

3.2

 

3.5

ns

OE

 

 

 

tCLZ

 

Clock to Low-Z[20, 21, 22]

1.25

 

1.5

 

1.5

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid after CLK Rise

 

2.8

 

3.2

 

3.5

ns

tEOV

 

 

 

LOW to Output Valid

 

2.8

 

3.2

 

3.5

ns

OE

 

 

 

tDOH

 

Data Output Hold after CLK Rise

1.25

 

1.5

 

1.5

 

ns

tCHZ

 

Clock to High-Z[20, 21, 22]

1.25

2.8

1.5

3.2

1.5

3.5

ns

tCLZ

 

Clock to Low-Z[20, 21, 22]

1.25

 

1.5

 

1.5

 

ns

tEOHZ

 

 

 

HIGH to Output High-Z[20, 21, 22]

 

2.8

 

3.2

 

3.5

ns

OE

 

 

 

tEOLZ

 

 

 

LOW to Output Low-Z[20, 21, 22]

0

 

0

 

0

 

ns

OE

 

 

 

Set-up Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Set-up before CLK Rise

1.4

 

1.5

 

1.5

 

ns

tDS

 

Data Input Set-up before CLK Rise

1.4

 

1.5

 

1.5

 

ns

tCENS

 

 

 

 

 

 

Set-up before CLK Rise

1.4

 

1.5

 

1.5

 

ns

CEN

 

 

 

tWES

 

 

 

 

 

 

 

x Set-up before CLK Rise

1.4

 

1.5

 

1.5

 

ns

WE,

BW

 

 

 

tALS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Set-up before CLK Rise

1.4

 

1.5

 

1.5

 

ns

tCES

 

Chip Select Set-up

1.4

 

1.5

 

1.5

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold after CLK Rise

0.4

 

0.5

 

0.5

 

ns

tDH

 

Data Input Hold after CLK Rise

0.4

 

0.5

 

0.5

 

ns

tCENH

 

 

 

 

Hold after CLK Rise

0.4

 

0.5

 

0.5

 

ns

CEN

 

 

 

tWEH

 

 

 

,

 

 

 

x Hold after CLK Rise

0.4

 

0.5

 

0.5

 

ns

WE

BW

 

 

 

tALH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Hold after CLK Rise

0.4

 

0.5

 

0.5

 

ns

tCEH

 

Chip Select Hold after CLK Rise

0.4

 

0.5

 

0.5

 

ns

Notes:

17.This part has a voltage regulator internally; tpower is the time power needs to be supplied above VDD minimum initially, before a Read or Write operation can be initiated.

18.Timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V.

19.Test conditions shown in (a) of AC Test Loads unless otherwise noted.

20.tCHZ, tCLZ, tEOLZ, and tEOHZ are specified with AC test conditions shown in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.

21.At any given voltage and temperature, tEOHZ is less than tEOLZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions.

22.This parameter is sampled and not 100% tested.

Document #: 38-05538 Rev. *G

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram-CY7C1354C 256K x Functional Description1250 MHz 200 MHz 166 MHz Unit Logic Block Diagram-CY7C1356C 512K xMaximum Access Time Maximum Operating Current Selection Guide512K × Pin Configurations Pin Tqfp PinoutCY7C1354C 256K × Pin Configurations Ball BGA PinoutCY7C1356C 512K x CY7C1356C 512K × Pin Configurations Ball Fbga PinoutPin Definitions Functional Overview Single Read AccessesBurst Read Accesses Single Write AccessesLinear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Function CY7C1356C Sleep ModePartial Write Cycle Description2, 3, 4 Function CY7C1354CTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterSet-up Times TAP TimingParameter Description Min Max Unit Clock Output TimesIdentification Register Definitions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions 5V TAP AC Test ConditionsInstruction Code Description Scan Register SizesIdentification Codes Register Name Bit SizeBit # Ball ID Boundary Scan Exit Order 256K ×K10 Boundary Scan Exit Order 512K ×B10 J10Ambient Range Electrical Characteristics Over the Operating Range14Maximum Ratings Operating Range3V I/O Test Load Capacitance16Thermal Resistance AC Test Loads and Waveforms250 200 166 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 18A6 A7 ADV/LD BWXData Out DQNOP,STALL and Deselect Cycles23, 24 Switching WaveformsDON’T Care ZZ Mode Timing27Ordering Information CY7C1354C CY7C1356C Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmSoldernotespad Type NON-SOLDER Mask Defined Nsmd Document History ECN No Issue Date Orig. Description of Change