Cypress CY7C1356C, CY7C1354C manual Maximum Ratings, Operating Range, Ambient Range

Page 17

CY7C1354C

CY7C1356C

Maximum Ratings

(Above which the useful life may be impaired. For user guide- lines, not tested.)

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.5V to +4.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to +VDD

DC to Outputs in Tri-State

–0.5V to VDDQ + 0.5V

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

 

20 mA

Static Discharge Voltage

 

> 2001V

(per MIL-STD-883, Method 3015)

 

Latch-up Current

 

> 200 mA

Operating Range

 

 

 

 

 

 

 

Ambient

 

 

Range

Temperature

VDD

VDDQ

Commercial

0°C to +70°C

3.3V –5%/+10%

2.5V – 5%

 

 

 

to VDD

Industrial

–40°C to +85°C

 

Electrical Characteristics Over the Operating Range[14, 15]

Parameter

Description

Test Conditions

Min.

Max.

Unit

VDD

Power Supply Voltage

 

 

3.135

3.6

V

VDDQ

I/O Supply Voltage

for 3.3V I/O

 

3.135

VDD

V

 

 

for 2.5V I/O

 

2.375

2.625

V

 

 

 

 

 

 

 

VOH

Output HIGH Voltage

for 3.3V I/O, IOH = 4.0 mA

 

2.4

 

V

 

 

for 2.5V I/O, IOH = 1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

for 3.3V I/O, IOL= 8.0 mA

 

 

0.4

V

 

 

for 2.5V I/O, IOL= 1.0 mA

 

 

0.4

V

VIH

Input HIGH Voltage

for 3.3V I/O

 

2.0

VDD + 0.3V

V

 

 

for 2.5V I/O

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage[16]

for 3.3V I/O

 

–0.3

0.8

V

 

 

for 2.5V I/O

 

–0.3

0.7

V

 

 

 

 

 

 

 

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

A

 

except ZZ and MODE

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

A

 

 

Input = VDD

 

 

5

A

 

Input Current of ZZ

Input = VSS

 

–5

 

A

 

 

Input = VDD

 

 

30

A

IOZ

Output Leakage Current

GND VI VDDQ, Output Disabled

–5

5

A

IDD

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

4-ns cycle, 250 MHz

 

250

mA

 

 

f = fMAX = 1/tCYC

 

 

 

 

 

 

5-ns cycle, 200 MHz

 

220

mA

 

 

 

6-ns cycle, 166 MHz

 

180

mA

 

 

 

 

 

 

 

ISB1

Automatic CE

Max. VDD, Device Deselected,

4-ns cycle, 250 MHz

 

130

mA

 

Power-down

VIN VIH or VIN VIL, f = fMAX

 

 

 

 

 

5-ns cycle, 200 MHz

 

120

mA

 

Current—TTL Inputs

= 1/tCYC

 

 

 

 

 

6-ns cycle, 166 MHz

 

110

mA

 

 

 

 

 

 

 

 

 

 

 

ISB2

Automatic CE

Max. VDD, Device Deselected,

All speed grades

 

40

mA

 

Power-down

VIN 0.3V or VIN > VDDQ 0.3V,

 

 

 

 

 

Current—CMOS Inputs

f = 0

 

 

 

 

ISB3

Automatic CE

Max. VDD, Device Deselected,

4-ns cycle, 250 MHz

 

120

mA

 

Power-down

VIN 0.3V or VIN > VDDQ 0.3V,

 

 

 

 

 

5-ns cycle, 200 MHz

 

110

mA

 

Current—CMOS Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

6-ns cycle, 166 MHz

 

100

mA

 

 

 

 

 

 

 

 

 

 

 

ISB4

Automatic CE

Max. VDD, Device Deselected,

All speed grades

 

40

mA

 

Power-down

VIN VIH or VIN VIL, f = 0

 

 

 

 

 

Current—TTL Inputs

 

 

 

 

 

Notes:

14.Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC)> –2V (Pulse width less than tCYC/2).

15.TPower-up: Assumes a linear ramp from 0V to VDD (min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

16.Tested initially and after any design or process changes that may affect these parameters.

Document #: 38-05538 Rev. *G

Page 17 of 28

[+] Feedback

Image 17
Contents Logic Block Diagram-CY7C1354C 256K x FeaturesFunctional Description1 Cypress Semiconductor CorporationMaximum Access Time Maximum Operating Current Logic Block Diagram-CY7C1356C 512K xSelection Guide 250 MHz 200 MHz 166 MHz Unit512K × Pin Configurations Pin Tqfp PinoutCY7C1356C 512K x Pin Configurations Ball BGA PinoutCY7C1354C 256K × CY7C1356C 512K × Pin Configurations Ball Fbga PinoutPin Definitions Burst Read Accesses Single Read AccessesSingle Write Accesses Functional OverviewZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Partial Write Cycle Description2, 3, 4 Sleep ModeFunction CY7C1354C Function CY7C1356CIeee 1149.1 Serial Boundary Scan Jtag TAP Controller Block DiagramTAP Controller State Diagram TAP Instruction Set Bypass RegisterParameter Description Min Max Unit Clock TAP TimingOutput Times Set-up Times3V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions Identification Register DefinitionsIdentification Codes Scan Register SizesRegister Name Bit Size Instruction Code DescriptionBit # Ball ID Boundary Scan Exit Order 256K ×B10 Boundary Scan Exit Order 512K ×J10 K10Maximum Ratings Electrical Characteristics Over the Operating Range14Operating Range Ambient RangeThermal Resistance Capacitance16AC Test Loads and Waveforms 3V I/O Test Load250 200 166 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 18Data ADV/LD BWXOut DQ A6 A7NOP,STALL and Deselect Cycles23, 24 Switching WaveformsDON’T Care ZZ Mode Timing27Ordering Information CY7C1354C CY7C1356C Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmSoldernotespad Type NON-SOLDER Mask Defined Nsmd Document History ECN No Issue Date Orig. Description of Change