Cypress CY7C1354C TAP Timing, Parameter Description Min Max Unit Clock, Output Times, Hold Times

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CY7C1354C

CY7C1356C

PRELOAD allows an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells prior to the selection of another boundary scan test operation.

The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in.

BYPASS

When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass

register is placed between the TDI and TDO balls. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board.

Reserved

These instructions are not implemented but are reserved for future use. Do not use these instructions.

TAP Timing

12

Test Clock

(TCK)tTH

tTMSS tTMSH

Test Mode Select (TMS)

tTDIS tTDIH

Test Data-In (TDI)

3

4

5

6

tTL tCYC

tTDOV

tTDOX

 

Test Data-Out

 

 

 

 

(TDO)

 

 

 

 

DON’T CARE

UNDEFINED

 

 

TAP AC Switching Characteristics Over the Operating Range[10, 11]

 

 

Parameter

Description

Min.

Max.

Unit

Clock

 

 

 

 

tTCYC

TCK Clock Cycle Time

50

 

ns

tTF

TCK Clock Frequency

 

20

MHz

tTH

TCK Clock HIGH time

20

 

ns

tTL

TCK Clock LOW time

20

 

ns

Output Times

 

 

 

tTDOV

TCK Clock LOW to TDO Valid

 

10

ns

tTDOX

TCK Clock LOW to TDO Invalid

0

 

ns

Set-up Times

 

 

 

tTMSS

TMS Set-up to TCK Clock Rise

5

 

ns

tTDIS

TDI Set-up to TCK Clock Rise

5

 

ns

tCS

Capture Set-up to TCK Rise

5

 

ns

Hold Times

 

 

 

 

tTMSH

TMS Hold after TCK Clock Rise

5

 

ns

tTDIH

TDI Hold after Clock Rise

5

 

ns

tCH

Capture Hold after Clock Rise

5

 

ns

Notes:

10.tCS and tCH refer to the set-up and hold time requirements of latching data from the boundary scan register.

11.Test conditions are specified using the load in TAP AC test Conditions. tR/tF = 1 ns.

Document #: 38-05538 Rev. *G

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Contents Features Logic Block Diagram-CY7C1354C 256K xFunctional Description1 Cypress Semiconductor CorporationLogic Block Diagram-CY7C1356C 512K x Maximum Access Time Maximum Operating CurrentSelection Guide 250 MHz 200 MHz 166 MHz UnitPin Configurations Pin Tqfp Pinout 512K ×Pin Configurations Ball BGA Pinout CY7C1354C 256K ×CY7C1356C 512K x Pin Configurations Ball Fbga Pinout CY7C1356C 512K ×Pin Definitions Single Read Accesses Burst Read AccessesSingle Write Accesses Functional OverviewInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Sleep Mode Partial Write Cycle Description2, 3, 4Function CY7C1354C Function CY7C1356CTAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag Bypass Register TAP Instruction SetTAP Timing Parameter Description Min Max Unit ClockOutput Times Set-up TimesTAP DC Electrical Characteristics And Operating Conditions 3V TAP AC Test Conditions5V TAP AC Test Conditions Identification Register DefinitionsScan Register Sizes Identification CodesRegister Name Bit Size Instruction Code DescriptionBoundary Scan Exit Order 256K × Bit # Ball IDBoundary Scan Exit Order 512K × B10J10 K10Electrical Characteristics Over the Operating Range14 Maximum RatingsOperating Range Ambient RangeCapacitance16 Thermal ResistanceAC Test Loads and Waveforms 3V I/O Test LoadSwitching Characteristics Over the Operating Range 18 250 200 166 Parameter Description Unit Min MaxADV/LD BWX DataOut DQ A6 A7Switching Waveforms NOP,STALL and Deselect Cycles23, 24ZZ Mode Timing27 DON’T CareOrdering Information CY7C1354C CY7C1356C Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm 90±0.05Soldernotespad Type NON-SOLDER Mask Defined Nsmd ECN No Issue Date Orig. Description of Change Document History