CY7C1354C
CY7C1356C
Package Diagrams (continued)
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
15.00±0.10 | 15.00±0.10 |
TOP VIEW
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| TOP VIEW |
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| PIN 1 CORNER |
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| PIN 1 CORNER |
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| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
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A |
| 1 |
| 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
B | A |
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CB
DC
ED
FE
GF
HG
JH
KJ
LK
ML
NM
PN
RP R
15.00±0.10 | 15.00±0.10 |
| 14.00 |
1.00 | 1.00 |
14.00 |
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7.00 | 7.00 |
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| BOTTOM VIEW |
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| BOTTOM VIEWPIN 1 CORNER |
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| PIN 1 CORNER | |||
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| Ø0.05 M C |
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| Ø0.05 M C |
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| Ø0.25 M C A B |
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| Ø0.50 | .25 M C A B |
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| +0.14 |
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11 | 10 | 9 | 8 | 7 | 6 | 5 | Ø0.50 | (165X) |
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4 | 3 | 2 | 1 |
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| +0.14 |
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| 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1A | ||
BA
CB
DC
ED
FE
GF
HG
JH
KJ
LK
ML
NM
PN
RP
R
A
A
| B |
| 13.00±0.10 |
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| B | 13.00±0.10 |
0.25 C | 00.25.3±0C .05 | 0.53±0.05 |
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| C | SEATING PLANE |
| 0.36 | SEATING PLANE | |
| 0.36 |
C
A
1.40 MAX. | 0.15 C 1.40MAX. | 0.15C |
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0.35±0.06 | 0.35±0.06 |
| 1.00 |
A | 5.00 |
1.00 | |
| 5.00 |
| 10.00 |
| 10.00 |
B | 13.00±0.10 |
B | 13.00±0.10 |
0.15(4X) |
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0.15(4X) |
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NOTES : |
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SOLDERNOTESPAD TYPE: : NON-SOLDER MASK DEFINED (NSMD)
PACKAGESOLDERW IGHTPAD: 0TYPE.475g:
JEDEC REFERENCEPACKAGE WEIGHT:
PACKAGEJEDECODEREFERENCE: BB0AC :
PACKAGE CODE : BB0AC
NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders
Document #: | Page 27 of 28 |
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in
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