Cypress CY7C1356C manual Features, Functional Description1, Logic Block Diagram-CY7C1354C 256K x

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CY7C1354C

CY7C1356C

9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL™ Architecture

Features

Pin-compatible and functionally equivalent to ZBT

Supports 250-MHz bus operations with zero wait states

Available speed grades are 250, 200, and 166 MHz

Internally self-timed output buffer control to eliminate the need to use asynchronous OE

Fully registered (inputs and outputs) for pipelined operation

Byte Write capability

Single 3.3V power supply (VDD)

3.3V or 2.5V I/O power supply (VDDQ)

Fast clock-to-output times

2.8 ns (for 250-MHz device)

Clock Enable (CEN) pin to suspend operation

Synchronous self-timed writes

Available in lead-free 100-Pin TQFP package, lead-free and non lead-free 119-Ball BGA package and 165-Ball FBGA package

IEEE 1149.1 JTAG-Compatible Boundary Scan

Burst capabilitylinear or interleaved burst order

“ZZ” Sleep Mode option and Stop Clock option

Functional Description[1]

The CY7C1354C and CY7C1356C are 3.3V, 256K x 36 and 512K x 18 Synchronous pipelined burst SRAMs with No Bus Latency™ (NoBL™) logic, respectively. They are designed to support unlimited true back-to-back Read/Write operations with no wait states. The CY7C1354C and CY7C1356C are equipped with the advanced (NoBL) logic required to enable consecutive Read/Write operations with data being trans- ferred on every clock cycle. This feature dramatically improves the throughput of data in systems that require frequent Write/Read transitions. The CY7C1354C and CY7C1356C are pin compatible and functionally equivalent to ZBT devices.

All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle.

Write operations are controlled by the Byte Write Selects (BWa–BWdfor CY7C1354C and BWa–BWbfor CY7C1356C) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. In order to avoid bus contention, the output drivers are synchronously tri-stated during the data portion of a write sequence.

Logic Block Diagram–CY7C1354C (256K x 36)

 

A0, A1, A

ADDRESS

 

 

 

 

 

 

 

 

 

 

 

REGISTER 0

A1

D1

Q1

A1'

 

 

 

 

 

 

MODE

 

A0

D0 BURST Q0 A0'

 

 

 

 

 

 

 

ADV/LD

 

LOGIC

 

 

 

 

 

 

CLK

C

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

CEN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WRITE ADDRESS

WRITE ADDRESS

 

 

 

 

 

 

 

 

 

REGISTER 1

REGISTER 2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

S

O

 

O

 

 

 

 

 

 

 

 

U

D

 

 

 

 

 

 

 

 

E

T

U

 

 

 

 

 

 

 

 

P

A

T

 

 

 

 

 

 

 

 

N

 

 

 

 

 

 

 

 

U

T

P

 

ADV/LD

 

 

 

 

 

 

S

T

A

U

 

 

 

 

 

 

 

R

T

 

 

 

WRITE REGISTRY

 

 

 

MEMORY

E

S

B

 

BWa

 

AND DATA COHERENCY

 

 

WRITE

 

E

 

 

 

 

ARRAY

 

 

BWb

 

CONTROL LOGIC

 

 

DRIVERS

A

G

T

U

 

 

 

 

 

 

I

F

 

BWc

 

 

 

 

 

 

M

S

E

 

 

 

 

 

 

 

F

 

BWd

 

 

 

 

 

 

P

E

E

E

 

 

 

 

 

 

 

 

T

R

R

 

WE

 

 

 

 

 

 

S

R

 

 

 

 

 

 

 

 

 

S

I

S

 

 

 

 

 

 

 

 

 

E

N

E

 

 

 

 

 

 

 

 

 

 

G

 

 

 

 

 

 

 

 

INPUT

E

 

INPUT

E

 

 

 

 

 

 

 

REGISTER 1

 

REGISTER 0

 

OE

READ LOGIC

 

 

 

 

 

 

 

 

 

CE1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CE2

 

 

 

 

 

 

 

 

 

 

 

CE3

 

 

 

 

 

 

 

 

 

 

 

ZZ

SLEEP

 

 

 

 

 

 

 

 

 

CONTROL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DQs DQPa DQPb DQPc DQPd

Note:

1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.

Cypress Semiconductor Corporation

198 Champion Court • San Jose, CA 95134-1709

408-943-2600

Document #: 38-05538 Rev. *G

 

Revised September 14, 2006

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Contents Logic Block Diagram-CY7C1354C 256K x FeaturesFunctional Description1 Cypress Semiconductor CorporationMaximum Access Time Maximum Operating Current Logic Block Diagram-CY7C1356C 512K xSelection Guide 250 MHz 200 MHz 166 MHz Unit512K × Pin Configurations Pin Tqfp PinoutCY7C1354C 256K × Pin Configurations Ball BGA PinoutCY7C1356C 512K x CY7C1356C 512K × Pin Configurations Ball Fbga PinoutPin Definitions Burst Read Accesses Single Read AccessesSingle Write Accesses Functional OverviewLinear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Partial Write Cycle Description2, 3, 4 Sleep ModeFunction CY7C1354C Function CY7C1356CTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterParameter Description Min Max Unit Clock TAP TimingOutput Times Set-up Times3V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions Identification Register DefinitionsIdentification Codes Scan Register SizesRegister Name Bit Size Instruction Code DescriptionBit # Ball ID Boundary Scan Exit Order 256K ×B10 Boundary Scan Exit Order 512K ×J10 K10Maximum Ratings Electrical Characteristics Over the Operating Range14Operating Range Ambient RangeThermal Resistance Capacitance16AC Test Loads and Waveforms 3V I/O Test Load250 200 166 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 18Data ADV/LD BWXOut DQ A6 A7NOP,STALL and Deselect Cycles23, 24 Switching WaveformsDON’T Care ZZ Mode Timing27Ordering Information CY7C1354C CY7C1356C Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmSoldernotespad Type NON-SOLDER Mask Defined Nsmd Document History ECN No Issue Date Orig. Description of Change