Cypress CY7C1482V25 manual TAP Timing, TAP AC Switching Characteristics Over the Operating Range9

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CY7C1480V25

CY7C1482V25

CY7C1486V25

The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CLK captured in the boundary scan register.

After the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO balls.

Note that because the PRELOAD part of the command is not implemented, putting the TAP to the Update-DR state while performing a SAMPLE/PRELOAD instruction has the same effect as the Pause-DR command.

BYPASS

When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO balls. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board.

Reserved

These instructions are not implemented but are reserved for future use. Do not use these instructions.

TAP Timing

1

2

Test Clock

 

(TCK)

tTH

 

tTMSS

tTMSH

Test Mode Select

 

(TMS)

 

tTDIS

tTDIH

Test Data-In

 

(TDI)

 

3

4

5

6

tTL tCYC

tTDOV

tTDOX

Test Data-Out (TDO)

DON’T CARE

UNDEFINED

TAP AC Switching Characteristics Over the Operating Range[9, 10]

Parameter

Description

Min

Max

Unit

Clock

 

 

 

 

 

 

 

 

 

tTCYC

TCK Clock Cycle Time

50

 

ns

tTF

TCK Clock Frequency

 

20

MHz

tTH

TCK Clock HIGH time

20

 

ns

tTL

TCK Clock LOW time

20

 

ns

Output Times

 

 

 

tTDOV

TCK Clock LOW to TDO Valid

 

10

ns

tTDOX

TCK Clock LOW to TDO Invalid

0

 

ns

Setup Times

 

 

 

 

tTMSS

TMS Setup to TCK Clock Rise

5

 

ns

tTDIS

TDI Setup to TCK Clock Rise

5

 

ns

tCS

Capture Setup to TCK Rise

5

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

tTMSH

TMS Hold after TCK Clock Rise

5

 

ns

tTDIH

TDI Hold after Clock Rise

5

 

ns

tCH

Capture Hold after Clock Rise

5

 

ns

Notes

9.tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.

10.Test conditions are specified using the load in TAP AC Test Conditions. tR/tF = 1 ns.

Document #: 38-05282 Rev. *H

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Contents Selection Guide FeaturesFunctional Description1 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1480V25 2M x Logic Block Diagram CY7C1482V25 4M xLogic Block Diagram CY7C1486V25 1M x CLRCY7C1482V25 4M x Pin Configurations Pin Tqfp PinoutCY7C1480V25 2M x CY7C1482V25 4M x DQ B DQP G DQP C DQ G DQ BDQ G DQP F DQP B DQ CPin Definitions Functional Overview Single Read AccessesSingle Write Accesses Initiated by Adsp TDIZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Truth Table Operation Add. UsedTruth Table for Read/Write FunctionIeee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramTAP Controller Block Diagram Instruction Register TAP Instruction SetParameter Description Min Max Unit Clock TAP AC Switching Characteristics Over the Operating Range9TAP Timing Output Times8V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions Parameter Description Test Conditions MinBoundary Scan Exit Order 2M x Scan Register SizesIdentification Codes P10 Boundary Scan Exit Order 4M xA11 A10 M10Boundary Scan Exit Order 1M x Operating Range Electrical Characteristics Over the Operating Range12Maximum Ratings Range AmbientAC Test Loads and Waveforms Capacitance14Thermal Resistance14 Parameter Description 250 MHz 200 MHz 167 MHz Unit Min Max Switching Characteristics Over the Operating Range15Setup Times Switching Waveforms Read Cycle Timing21Write Cycle Timing21 Read/Write Cycle Timing21, 23 ZZ Mode Timing25 DON’T CareOrdering Information 250 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document Number Issue Date Orig. Description of ChangeDocument History VKN/KKVTMP