Cypress CY7C1486V25 manual Ieee 1149.1 Serial Boundary Scan Jtag, TAP Controller State Diagram

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CY7C1480V25

CY7C1482V25

CY7C1486V25

IEEE 1149.1 Serial Boundary Scan (JTAG)

The CY7C1480V25/CY7C1482V25/CY7C1486V25 incorpo- rates a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM. Note that the TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1 fully compliant TAPs. The TAP operates using JEDEC-standard 2.5V or 1.8V I/O logic levels.

The CY7C1480V25/CY7C1482V25/CY7C1486V25 contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.

Disabling the JTAG Feature

Test Mode Select (TMS)

The TMS input gives commands to the TAP controller and is sampled on the rising edge of TCK. You can leave this ball unconnected if the TAP is not used. The ball is pulled up inter- nally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI ball serially inputs information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be uncon- nected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) of any register. (See TAP Controller Block Diagram.)

It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent device clocking. TDI and TMS are internally pulled up and may be unconnected. They may alternatively be connected to VDD through a pull up resistor. TDO must be left unconnected. At power up, the device comes up in a reset state, which does not interfere with the operation of the device.

TAP Controller State Diagram

Test Data-Out (TDO)

The TDO output ball is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine. The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. (See TAP Controller State Diagram.)

TAP Controller Block Diagram

1 TEST-LOGIC RESET

0

0 RUN-TEST/ 1

IDLE

SELECT

1

SELECT

1

DR-SCA N

 

IR-SCA N

 

0

 

0

 

1

 

1

 

CA PTURE-DR

 

CA PTURE-IR

 

0

 

0

 

SHIFT-DR

0

SHIFT-IR

0

1

 

1

 

EXIT1-DR

1

EXIT1-IR

1

 

 

0

 

0

 

TDI

Selection Circuitry

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bypass Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Instruction Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

31

30

29

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Identification Register

 

 

 

 

 

 

 

 

 

 

 

x

.

.

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Register

Selection Circuitry

TDO

 

 

PA USE-DR

0

 

 

PA USE-IR

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

1

 

 

 

 

0

 

 

 

 

 

 

0

 

 

 

 

 

 

EXIT2-DR

 

 

EXIT2-IR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

UPDA TE-DR

 

 

 

UPDA TE-IR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

0

 

 

 

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TCK

TAP CONTROLLER

TM S

Performing a TAP Reset

Perform a RESET by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating.

The 0/1 next to each state represents the value of TMS at the rising edge of TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

At power up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

TAP Registers

Registers are connected between the TDI and TDO balls and enable data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK. Data is output on the TDO ball on the falling edge of TCK.

Document #: 38-05282 Rev. *H

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Contents Features Functional Description1Selection Guide 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1480V25 2M x Logic Block Diagram CY7C1482V25 4M xLogic Block Diagram CY7C1486V25 1M x CLRPin Configurations Pin Tqfp Pinout CY7C1480V25 2M xCY7C1482V25 4M x CY7C1482V25 4M x DQ G DQ B DQ GDQ B DQP G DQP C DQP F DQP B DQ CPin Definitions Single Read Accesses Single Write Accesses Initiated by AdspFunctional Overview TDIInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Truth Table Operation Add. UsedTruth Table for Read/Write FunctionTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag Instruction Register TAP Instruction SetTAP AC Switching Characteristics Over the Operating Range9 TAP TimingParameter Description Min Max Unit Clock Output TimesTAP DC Electrical Characteristics And Operating Conditions 5V TAP AC Test Conditions8V TAP AC Test Conditions Parameter Description Test Conditions MinScan Register Sizes Identification CodesBoundary Scan Exit Order 2M x Boundary Scan Exit Order 4M x A11 A10P10 M10Boundary Scan Exit Order 1M x Electrical Characteristics Over the Operating Range12 Maximum RatingsOperating Range Range AmbientCapacitance14 Thermal Resistance14AC Test Loads and Waveforms Switching Characteristics Over the Operating Range15 Setup TimesParameter Description 250 MHz 200 MHz 167 MHz Unit Min Max Switching Waveforms Read Cycle Timing21Write Cycle Timing21 Read/Write Cycle Timing21, 23 ZZ Mode Timing25 DON’T CareOrdering Information 250 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Issue Date Orig. Description of Change Document HistoryDocument Number VKN/KKVTMP