Cypress CY7C1480V25, CY7C1486V25, CY7C1482V25 manual Maximum Ratings, Operating Range, Range Ambient

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CY7C1480V25

CY7C1482V25

CY7C1486V25

Maximum Ratings

Exceeding the maximum ratings may impair the useful life of the device. These user guidelines are not tested.

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.3V to +3.6V

Supply Voltage on VDDQ Relative to GND

–0.3V to +VDD

DC Voltage Applied to Outputs

–0.5V to VDDQ + 0.5V

in Tri-State

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

 

20 mA

Static Discharge Voltage

 

>2001V

(MIL-STD-883, Method 3015)

 

 

Latch Up Current

 

>200 mA

Operating Range

 

 

 

 

 

 

Range

Ambient

VDD

VDDQ

Temperature

Commercial

0°C to +70°C

2.5V –5%/+5%

1.7V to

 

 

 

VDD

Industrial

–40°C to +85°C

 

Electrical Characteristics Over the Operating Range[12, 13]

Parameter

Description

Test Conditions

Min

Max

Unit

VDD

Power Supply Voltage

 

 

2.375

2.625

V

VDDQ

IO Supply Voltage

for 2.5V IO

 

2.375

VDD

V

 

 

for 1.8V IO

 

1.7

1.9

V

 

 

 

 

 

 

 

VOH

Output HIGH Voltage

for 2.5V IO, IOH = –1.0 mA

 

2.0

 

V

 

 

for 1.8V IO, IOH = –100 A

 

1.6

 

V

VOL

Output LOW Voltage

for 2.5V IO, IOL = 1.0 mA

 

 

0.4

V

 

 

for 1.8V IO, IOL = 100 A

 

 

0.2

V

VIH

Input HIGH Voltage[12]

for 2.5V IO

 

1.7

VDD + 0.3V

V

 

 

for 1.8V IO

 

1.26

VDD + 0.3V

V

VIL

Input LOW Voltage[12]

for 2.5V IO

 

–0.3

0.7

V

 

 

for 1.8V IO

 

–0.3

0.36

V

 

 

 

 

 

 

 

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

A

 

except ZZ and MODE

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

A

 

 

Input = VDD

 

 

5

A

 

Input Current of ZZ

Input = VSS

 

–5

 

A

 

 

Input = VDD

 

 

30

A

IOZ

Output Leakage Current

GND VI VDDQ, Output Disabled

 

–5

5

A

IDD

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

4.0-ns cycle, 250 MHz

 

450

mA

 

Current

f = fMAX = 1/tCYC

 

 

 

 

 

5.0-ns cycle, 200 MHz

 

450

mA

 

 

 

6.0-ns cycle, 167 MHz

 

400

mA

 

 

 

 

 

 

 

ISB1

Automatic CE

VDD = Max, Device Deselected,

4.0-ns cycle, 250 MHz

 

200

mA

 

Power Down

VIN VIH or VIN VIL

 

 

 

 

 

5.0-ns cycle, 200 MHz

 

200

mA

 

Current—TTL Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

6.0-ns cycle, 167 MHz

 

200

mA

 

 

 

 

 

 

 

 

 

 

 

ISB2

Automatic CE

VDD = Max, Device Deselected,

All speeds

 

120

mA

 

Power Down

VIN 0.3V or VIN > VDDQ – 0.3V,

 

 

 

 

 

Current—CMOS Inputs

f = 0

 

 

 

 

ISB3

Automatic CE

VDD = Max, Device Deselected, or

4.0-ns cycle, 250 MHz

 

200

mA

 

Power Down

VIN 0.3V or VIN > VDDQ – 0.3V

 

 

 

 

 

5.0-ns cycle, 200 MHz

 

200

mA

 

Current—CMOS Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

6.0-ns cycle, 167 MHz

 

200

mA

 

 

 

 

 

 

 

 

 

 

 

ISB4

Automatic CE

VDD = Max, Device Deselected,

All speeds

 

135

mA

 

Power Down

VIN VIH or VIN VIL, f = 0

 

 

 

 

 

Current—TTL Inputs

 

 

 

 

 

Notes

 

 

 

 

 

 

12.Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC) > –2V (Pulse width less than tCYC/2).

13.Power up: Assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

Document #: 38-05282 Rev. *H

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Contents 250 MHz 200 MHz 167 MHz Unit FeaturesFunctional Description1 Selection GuideLogic Block Diagram CY7C1482V25 4M x Logic Block Diagram CY7C1480V25 2M xCLR Logic Block Diagram CY7C1486V25 1M xCY7C1480V25 2M x Pin Configurations Pin Tqfp PinoutCY7C1482V25 4M x CY7C1482V25 4M x DQP F DQP B DQ C DQ G DQ BDQ G DQ B DQP G DQP CPin Definitions TDI Single Read AccessesSingle Write Accesses Initiated by Adsp Functional OverviewLinear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Operation Add. Used Truth TableFunction Truth Table for Read/WriteTAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Instruction RegisterOutput Times TAP AC Switching Characteristics Over the Operating Range9TAP Timing Parameter Description Min Max Unit ClockParameter Description Test Conditions Min TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions 8V TAP AC Test ConditionsIdentification Codes Scan Register SizesBoundary Scan Exit Order 2M x M10 Boundary Scan Exit Order 4M xA11 A10 P10Boundary Scan Exit Order 1M x Range Ambient Electrical Characteristics Over the Operating Range12Maximum Ratings Operating RangeThermal Resistance14 Capacitance14AC Test Loads and Waveforms Setup Times Switching Characteristics Over the Operating Range15Parameter Description 250 MHz 200 MHz 167 MHz Unit Min Max Read Cycle Timing21 Switching WaveformsWrite Cycle Timing21 Read/Write Cycle Timing21, 23 DON’T Care ZZ Mode Timing25Ordering Information 250 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History Issue Date Orig. Description of ChangeDocument Number VKN/KKVTMP