Cypress CY7C1486V25 manual Switching Characteristics Over the Operating Range15, Setup Times

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CY7C1480V25

CY7C1482V25

CY7C1486V25

Switching Characteristics Over the Operating Range[15, 16]

Parameter

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Description

250 MHz

200 MHz

167 MHz

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min.

Max.

Min.

Max.

Min.

Max.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tPOWER

 

VDD(Typical) to the first access[17]

1

 

1

 

1

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

5.0

 

6.0

 

ns

tCH

 

Clock HIGH

2.0

 

2.0

 

2.4

 

ns

tCL

 

Clock LOW

2.0

 

2.0

 

2.4

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid After CLK Rise

 

3.0

 

3.0

 

3.4

ns

tDOH

 

Data Output Hold After CLK Rise

1.3

 

1.3

 

1.5

 

ns

t

 

Clock to Low-Z[18, 19, 20]

1.3

 

1.3

 

1.5

 

ns

CLZ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

t

 

Clock to High-Z[18, 19, 20]

 

3.0

 

3.0

 

3.4

ns

CHZ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tOEV

 

 

 

LOW to Output Valid

 

3.0

 

3.0

 

3.4

ns

OE

tOELZ

 

 

 

LOW to Output Low-Z[18, 19, 20]

0

 

0

 

0

 

ns

OE

tOEHZ

 

 

 

HIGH to Output High-Z[18, 19, 20]

 

3.0

 

3.0

 

3.4

ns

OE

Setup Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Setup Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

tADS

 

 

 

 

 

 

 

 

 

 

 

 

 

Setup Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

ADSC,

ADSP

tADVS

 

 

 

 

 

Setup Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

ADV

tWES

 

 

 

 

 

 

 

 

 

 

 

 

 

X Setup Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

GW,

BWE,

BW

tDS

 

Data Input Setup Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

tCES

 

Chip Enable Setup Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

tADH

 

 

 

 

 

 

 

 

 

 

 

Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

ADSP,

ADSC

tADVH

 

 

 

 

Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

ADV

tWEH

 

 

 

 

 

 

 

 

 

 

 

 

 

X Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

GW,

BWE,

BW

tDH

 

Data Input Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

tCEH

 

Chip Enable Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

Notes

15.Timing reference level is 1.25V when VDDQ = 2.5V and is 0.9V when VDDQ = 1.8V.

16.Test conditions shown in (a) of “AC Test Loads and Waveforms” on page 20 unless otherwise noted.

17.This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a read or write operation can be initiated.

18.tCHZ, tCLZ, tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of AC Test Loads and Waveforms. Transition is measured ±200 mV from steady-state voltage.

19.At any possible voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z before Low-Z under the same system conditions.

20.This parameter is sampled and not 100% tested.

Document #: 38-05282 Rev. *H

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Contents Functional Description1 FeaturesSelection Guide 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1482V25 4M x Logic Block Diagram CY7C1480V25 2M xCLR Logic Block Diagram CY7C1486V25 1M xPin Configurations Pin Tqfp Pinout CY7C1480V25 2M xCY7C1482V25 4M x CY7C1482V25 4M x DQ G DQ G DQ BDQ B DQP G DQP C DQP F DQP B DQ CPin Definitions Single Write Accesses Initiated by Adsp Single Read AccessesFunctional Overview TDIInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Operation Add. Used Truth TableFunction Truth Table for Read/WriteTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Instruction RegisterTAP Timing TAP AC Switching Characteristics Over the Operating Range9Parameter Description Min Max Unit Clock Output Times5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions8V TAP AC Test Conditions Parameter Description Test Conditions MinScan Register Sizes Identification CodesBoundary Scan Exit Order 2M x A11 A10 Boundary Scan Exit Order 4M xP10 M10 Boundary Scan Exit Order 1M x Maximum Ratings Electrical Characteristics Over the Operating Range12Operating Range Range AmbientCapacitance14 Thermal Resistance14AC Test Loads and Waveforms Switching Characteristics Over the Operating Range15 Setup TimesParameter Description 250 MHz 200 MHz 167 MHz Unit Min Max Read Cycle Timing21 Switching WaveformsWrite Cycle Timing21 Read/Write Cycle Timing21, 23 DON’T Care ZZ Mode Timing25Ordering Information 250 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Issue Date Orig. Description of Change Document HistoryDocument Number VKN/KKVTMP