Cypress CY7C1460AV25, CY7C1464AV25, CY7C1462AV25 manual 250

Page 23

CY7C1460AV25

CY7C1462AV25

CY7C1464AV25

Ordering Information (continued)

Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or

visit www.cypress.com for actual products offered.

Speed

Ordering Code

Package

Part and Package Type

Operating

(MHz)

Diagram

Range

 

 

 

 

 

250

CY7C1460AV25-250AXC

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

Commercial

 

 

 

 

 

 

CY7C1462AV25-250AXC

 

 

 

 

 

 

 

 

 

CY7C1460AV25-250BZC

51-85165

165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)

 

 

 

 

 

 

 

CY7C1462AV25-250BZC

 

 

 

 

 

 

 

 

 

CY7C1460AV25-250BZXC

51-85165

165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free

 

 

 

 

 

 

 

CY7C1462AV25-250BZXC

 

 

 

 

 

 

 

 

 

CY7C1464AV25-250BGC

51-85167

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)

 

 

 

 

 

 

 

CY7C1464AV25-250BGXC

 

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free

 

 

 

 

 

 

 

CY7C1460AV25-250AXI

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

Industrial

 

 

 

 

 

 

CY7C1462AV25-250AXI

 

 

 

 

 

 

 

 

 

CY7C1460AV25-250BZI

51-85165

165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)

 

 

 

 

 

 

 

CY7C1462AV25-250BZI

 

 

 

 

 

 

 

 

 

CY7C1460AV25-250BZXI

51-85165

165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free

 

 

 

 

 

 

 

CY7C1462AV25-250BZXI

 

 

 

 

 

 

 

 

 

CY7C1464AV25-250BGI

51-85167

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)

 

 

 

 

 

 

 

CY7C1464AV25-250BGXI

 

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free

 

 

 

 

 

 

Document #: 38-05354 Rev. *D

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram-CY7C1460AV25 1M x Functional Description250 MHz 200 MHz 167 MHz Unit Logic Block Diagram-CY7C1462AV25 2M xLogic Block Diagram-CY7C1464AV25 512K x Selection Guide2M × Pin Configurations Pin Tqfp PinoutCY7C1462AV25 2M × ADV/LD Pin DefinitionsPin Name Type Pin Description Byte Write Select Inputs, active LOW. Qualified withClock input to the Jtag circuitry Power supply inputs to the core of the devicePower supply for the I/O circuitry Type Pin DescriptionBurst Write Accesses Single Read AccessesBurst Read Accesses Single Write AccessesZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Function CY7C1464AV25 Partial Write Cycle Description1, 2, 3Function CY7C1460AV25 BW d BW c BW b BW a Function CY7C1462AV25Performing a TAP Reset TAP Controller Block Diagram TAP Controller State DiagramDisabling the Jtag Feature Test Access Port TAPTAP Instruction Set Bypass RegisterSet-up Times TAP TimingParameter Description Min Max Unit Clock Output TimesIdentification Register Definitions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions 8V TAP AC Test ConditionsInstruction Code Description Scan Register SizesIdentification Codes Register Name Bit SizeBit# Ball ID Ball Fbga Boundary Scan Order12CY7C1460AV25 1M x 36, CY7C1462AV25 2M x Bit# Ball ID CY7C1464AV25 512K x Bit# Ball ID Ball Fbga Boundary Scan Order 12Ambient Range Electrical Characteristics Over the Operating Range14Maximum Ratings Operating RangeAC Test Loads and Waveforms Capacitance16Thermal Resistance 250 200 167 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 21NOP, Stall and Deselect Cycles23, 24 Switching WaveformsRead/Write/Timing23, 24 DON’T Care ZZ Mode Timing27Ordering Information 250 Pin Tqfp 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm RXU ECN No Issue Date Orig. Description of ChangeDocument History SYT

CY7C1462AV25, CY7C1460AV25, CY7C1464AV25 specifications

The Cypress CY7C1464AV25, CY7C1460AV25, and CY7C1462AV25 are a family of high-performance synchronous SRAM devices that have been designed for applications requiring fast memory access and low latency. These memory chips are particularly appealing for systems in telecommunications, networking, and embedded applications due to their versatility and robust performance specifications.

One of the standout features of the CY7C1464AV25 series is their large capacities. The CY7C1464AV25 offers a capacity of 4 Megabits (512 K x 8), making it well-suited for applications that demand ample memory while maintaining high-speed operations. In contrast, the CY7C1460AV25 and CY7C1462AV25 provide slightly smaller capacities of 1 Megabit (128 K x 8) and 2 Megabits (256 K x 8) respectively, catering to varying system memory requirements.

All three devices utilize Cypress's advanced synchronous SRAM technology. This enables the chips to support burst read and write modes, allowing for rapid data transfer rates. The CY7C1464AV25 delivers a data access time of as low as 5.5 ns, making it highly efficient for data-intensive applications. Additionally, the standard operating voltage of 2.5V aids in reducing power consumption and improving overall system energy efficiency.

The chips are also characterized by a simple interface and compatibility with common bus protocols, which facilitates easy integration into existing systems. They feature a dual-port architecture, allowing multiple data transfers to occur simultaneously, significantly improving throughput.

With a commercial temperature range, all three devices offer reliability and are suited for a wide range of operating environments. The package options include a compact 44-pin TSOP, allowing for space-saving designs in modern electronics.

In summary, the Cypress CY7C1464AV25, CY7C1460AV25, and CY7C1462AV25 provide a powerful blend of capacity, speed, and efficiency, making them ideal choices for demanding applications in various sectors. Their advanced technologies and versatility make them excellent candidates for enhancing system performance while maintaining low power consumption and ensuring reliable operation in various conditions.
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