Cypress CY7C1347G manual Package Diagrams continued, 165-Ball FBGA 13 x 15 x 1.4 mm, Page 20 of

Page 20

CY7C1347G

Package Diagrams (continued)

15.00±0.10

TOP VIEW

PIN 1 CORNER

15.00±0.10

BOTTOM VIEW

1.00

5.00

10.00

0.25 C

13.00±0.10

SEATING PLANE

0.35±0.06

B 13.00±0.10

0.15(4X)

NOTES :

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC

51-85180 *A

Document #: 38-05516 Rev. *F

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Contents Features CY7C1347GSelection Guide Functional Description1Block Diagram ADDRESSREGISTER ADSCPinouts CY7C1347GCY7C1347G CY7C1347G Table 1. Pin DefinitionsName DescriptionSingle Read Accesses Single Write Accesses Initiated by ADSPSingle Write Accesses Initiated by ADSC Functional Overview2. X = “Do Not Care.” H = Logic HIGH, L = Logic LOW Table 5. Truth Table 2, 3, 4, 5 Electrical Characteristics Maximum RatingsOperating Range VDDQElectrical Characteristics continued CapacitanceThermal Resistance AC Test Loads and WaveformsSwitching Characteristics Switching Waveforms Figure 5. Read Cycle Timing16Switching Waveforms continued Figure 6. Write Cycle Timing1619. GW is HIGH Figure 7. Read/Write Cycle Timing16, 18Page 14 of 21. DQs are in high-Z when exiting ZZ sleep mode ALL INPUTS except ZZOrdering Information Ordering Information continued Package Diagrams Figure 9. 100-Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmPackage Diagrams continued Figure 10. 119-Ball BGA 14 x 22 x 2.4 mmPage 20 of PACKAGE WEIGHT 0.475gFigure 11. 165-Ball FBGA 13 x 15 x 1.4 mm Document History Page Document Title CY7C1347G 4-Mbit 128K x 36 Pipelined Sync SRAMDocument Number SubmissionSales, Solutions, and Legal Information PSoC SolutionsWorldwide Sales and Design Support Products