Cypress CY14B108L Pin Definitions Pin Name Type Description, Power Supply Inputs to the Device

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PRELIMINARY

CY14B108L, CY14B108N

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table 1. Pin Definitions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

I/O Type

 

 

 

 

Description

 

 

A0 – A19

Input

Address Inputs Used to Select one of the 1,048,576 bytes of the nvSRAM for x8 Configuration.

A0 – A18

 

Address Inputs Used to Select one of the 524,288 words of the nvSRAM for x16 Configuration.

DQ0 – DQ7

Input/Output

Bidirectional Data IO Lines for x8 Configuration. Used as input or output lines depending on

 

 

 

 

 

 

 

 

 

operation.

 

 

DQ0 – DQ15

 

Bidirectional Data IO Lines for x16 Configuration. Used as input or output lines depending on

 

 

 

 

 

 

 

 

 

operation.

 

 

 

 

 

 

 

 

 

 

Input

Write Enable Input, Active LOW. When selected LOW, data on the IO pins is written to the specific

 

 

WE

 

 

 

 

 

 

 

 

 

address location.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input

Chip Enable Input, Active LOW. When LOW, selects the chip. When HIGH, deselects the chip.

 

 

CE

 

 

 

 

 

 

 

 

Input

Output Enable, Active LOW. The active LOW

 

input enables the data output buffers during read

 

 

 

 

 

 

 

OE

 

 

OE

 

 

 

 

 

 

 

 

 

cycles. IO pins are tri-stated on deasserting OE HIGH.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input

Byte High Enable, Active LOW. Controls DQ15 - DQ8.

 

 

 

BHE

 

 

 

 

 

 

 

 

 

Input

Byte Low Enable, Active LOW. Controls DQ7 - DQ0.

 

 

 

BLE

 

 

 

VSS

Ground

Ground for the Device. Must be connected to the ground of the system.

 

VCC

Power Supply

Power Supply Inputs to the Device.

 

 

 

 

 

 

 

 

 

 

Input/Output

Hardware STORE Busy

 

. When LOW this output indicates that a Hardware STORE is in

 

 

 

 

 

 

 

 

(HSB)

 

HSB

 

 

 

 

 

 

 

 

 

progress. When pulled LOW external to the chip it initiates a nonvolatile STORE operation. A weak

 

 

 

 

 

 

 

 

 

internal pull up resistor keeps this pin HIGH if not connected (connection optional). After each STORE

 

 

 

 

 

 

 

 

 

operation HSB will be driven HIGH for short time with standard output high current.

 

 

 

VCAP

Power Supply

AutoStore Capacitor. Supplies power to the nvSRAM during power loss to store data from SRAM to

 

 

 

 

 

 

 

 

 

nonvolatile elements.

 

 

 

 

NC

No Connect

No Connect. This pin is not connected to the die.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Document #: 001-45523 Rev. *B

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram1, 2 Functional DescriptionPinouts Top ViewNot to scale Power Supply Inputs to the Device Output Enable, Active LOW . The active LO WByte High Enable, Active LOW . Controls DQ 15 DQ Byte Low Enable, Active LOW . Controls DQ 7 DQAutoStore Operation Device OperationSram Read Sram WriteHardware Recall Power Up Software StoreSoftware Recall Mode Selection StoreRecall Best Practices Preventing AutoStoreData Protection Noise ConsiderationsRange DC Electrical CharacteristicsMaximum Ratings Operating RangeAC Test Conditions Data Retention and EnduranceCapacitance Thermal ResistanceSram Write Cycle AC Switching CharacteristicsSwitching Waveforms Parameters Sram Read CycleSram Read Cycle #2 CE and OE Controlled3, 11 Sram Write Cycle #2 Parameters Description 20 ns 25 ns 45 ns Unit Min Max AutoStore/Power Up RecallSoftware Controlled STORE/RECALL Cycle Hardware Store Pulse Width To Output Active Time when write latch not setHardware Store Cycle Description 20 ns 25 ns 45 ns Unit Min MaxInputs/Outputs Mode Power Truth Table For Sram OperationsHigh Z CY14B108N-ZSP25XCT Ordering InformationCY14B108N-ZSP20XCT CY14B108N-ZSP20XITCY14B108N-ZSP45XIT CY14B108N-ZSP45XCTNvsram Part Numbering NomenclatureCY 14 B 108L-ZS P 20 X C T ZS TsopPin Tsop II Package DiagramsBall Fbga 6 mm x 10 mm x 1.2 mm 51-85160 Document History GvchGVCH/PYRS USB Sales, Solutions, and Legal Information