AMD 10 manual 256K L2 Cache Specifications

31994A —1August 2004 AMD Sempron™ Processor Model 10 with 256K L2 Cache Data Sheet

6333 FSB AMD Sempron™ Processor Model 10 with

256K L2 Cache Specifications

This chapter describes the electrical specifications that are unique to the advanced 333 front - side bus (FSB) AMD Sempron™ Processor Model 10 with 256K L2 cache.

6.1Electrical and Thermal Specifications for the AMD Sempron™ Processor Model 10 with 256K L2 Cache

Table 1 shows the electrical and thermal specifications in the

C0 working state and the S1 Stop Grant state for this processor.

Table 1. Electrical and Thermal Specifications for the AMD Sempron™ Processor Model 10 with 256K L2 Cache

	VCC_CORE	ICC (Processor Current)				Thermal Power		5
Frequency in MHz									Maximum Die
				Stop Grant S11, 2, 3, 4
	(Core	Working State C0
(Model Number)									Temperature
	Voltage)
		Maximum	Typical	Maximum	Typical	Maximum	Typical
1500 (2200+)	1.60 V	38.75 A	30.9 A	8.10 A	4.94 A	62.0 W	49.4 W		90°C
2000 (2800+)

Notes:

1.See Figure 3, "AMD Sempron™ Processor Model 10 Power Management States" on page 9.

2.The maximum Stop Grant currents are absolute worst case currents for parts that may yield from the worst case corner of the process and are not representative of the typical Stop Grant current that is currently about one-third of the maximum specified current.

3.These currents occur when the AMD Athlon™ system bus is disconnected and has a low power ratio of 1/8 for Stop Grant disconnect and a low power ratio of 1/8 Halt disconnect applied to the core clock grid of the processor as dictated by a value of 2003_1223h programmed into the Clock Control (CLK_Ctl) MSR. For more information, refer to the AMD Athlon™ and

AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656.

4.The Stop Grant current consumption is characterized at 50°C and not tested.

5.Thermal design power represents the maximum sustained power dissipated while executing publicly-available software or

instruction sequences under normal system operation at nominal VCC_CORE . Thermal solutions must monitor the temperature of the processor to prevent the processor from exceeding its maximum die temperature.

Chapter 6 333 FSB AMD Sempron™ Processor Model 10 with 256K L2 Cache Specifications 21