AMD 10 manual Mechanical Data, Die Loading, Mechanical Loading, Die Edge

31994A —1August 2004 AMD Sempron™ Processor Model 10 with 256K L2 Cache Data Sheet

9 Mechanical Data

The AMD Sempron™ processor model 10 connects to themotherboard through a Pin Grid Array (PGA) socket named Socket A. This processor utilizes the Organic Pin Grid Array (OPGA) package type described in this chapter. For more information, see the AMD Athlon™ Processor-Based Motherboard Design Guide, order# 24363.

9.1Die Loading

The processor die on the OPGA package is exposed at the top of the package. This feature facilitates heat transfer from the die to an approved heat sink. Any heat sink design should avoid loads on corners and edges of die. The OPGA package has compliant pads that serve to bring surfaces in planar contact. Tool-assisted zero insertion force sockets should be designed so that no load is placed on the ceramic substrate of the package.

Table 16 shows the mechanical loading specifications for the processor die. It is critical that the mechanical loading of the heat sink does not exceed the limits shown in Table 16.

Table 16. Mechanical Loading

Location	Dynamic (MAX)	Static (MAX)	Units	Note
Die Surface	100	30	lbf	1
Die Edge	10	10	lbf	2

Notes:

1. Load specified for coplanar contact to die surface.

2. Load defined for a surface at no more than a two-degree angle of inclination to die surface.

Chapter 9 Mechanical Data 43