CY7C1360C
CY7C1362C
Document #: 38-05540 Rev. *H Page 19 of 31
Capacitance[16]
Parameter Description Test Conditions 100 TQFP
Max. 119 BGA
Max. 165 FBGA
Max. Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
555pF
CCLK Clock Input Capacitance 5 5 5 pF
CI/O Input/Output Capacitance 5 7 7 pF
Thermal Resistance[16]
Parameter Description Test Conditions 100 TQFP
Package 119 BGA
Package 165 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51.
29.41 34.1 16.8 °C/W
ΘJC Thermal Resistance
(Junction to Case) 6.13 14.0 3 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
OUTPUT
R = 1667Ω
R =1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
Note:
16.Tested initially and after any design or process change that may affect these parameters.
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